-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
This Month in SMT007 Magazine: Test and Measurement in a Smart Factory
November 3, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
I spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”
Nolan Johnson: What are the changes to test and inspection’s role in the factory? Does it differ depending on whether you’re in the U.S., Europe, or Asia?
Brian D’Amico: Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines.
Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time.
For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Johnson: You mentioned three places to put test and inspection. In a more traditional “red light, green light” approach, test and inspection is an end-of-the line process.
D’Amico: While I understand and agree that most manufacturers rely on a single post-reflow AOI system, the problem is that it becomes more difficult to diagnose and resolve where an issue may have occurred within the manufacturing line because you’re only looking at a snapshot of the final result of all the other assembly equipment within the line. From there, you’re kind of guessing where the issue occurred.
An SPI system, for example, would provide immediate feedback on issues such as insufficient or excessive solder, solder bridging, or solder offset directly after solder deposition. These issues are typically related to process parameters, such as stroke speed for a screen printer, squeegee pressure, under-stencil cleaning, etc. The bottom line is that it is more difficult to diagnose screen printing issues based on data collected by post-reflow AOI.
To read this entire interview, which appeared in the November 2020 issue of SMT007 Magazine, click here.
Suggested Items
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.
Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024
03/13/2024 | PVANihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO
03/12/2024 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California.