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Did you know that really new, up-to-the-moment PCB technologies are nesting on the doorstep of PCB assemblers? In fact, some of these technologies are very mature, but they’re new to PCB assemblers.
For the past year or so, we’ve been talking about package-on-package (PoP) and 0.4 to 0.3-mm pitch BGAs as new technologies, and certainly a lot of OEMs are using them in their advanced products; others are quickly coming on board. But I’m not talking about those.
The ones I’m talking about are some more recent ones that EMS companies have recently discovered, while PCB technology has been evolving at such a rapid pace.
The technologies coming to our attention are:
- Wire bonding;
- Ribbon bonding;
- Die bonding;
- Extraordinarily fine-pitch 0.25-mm pitch BGAs;
- Buried resistance/buried capacitance; and
- Chip on board or CoB.
Editor's Note: This column originally appeared in the December 2013 issue of SMT Magazine.
05/25/2015 | Barry Matties, I-Connect007
In this interview with TopLine President and Founder Martin Hart, I-Connect007 Publisher Barry Matties focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.