Reading time ( words)
Did you know that really new, up-to-the-moment PCB technologies are nesting on the doorstep of PCB assemblers? In fact, some of these technologies are very mature, but they’re new to PCB assemblers.
For the past year or so, we’ve been talking about package-on-package (PoP) and 0.4 to 0.3-mm pitch BGAs as new technologies, and certainly a lot of OEMs are using them in their advanced products; others are quickly coming on board. But I’m not talking about those.
The ones I’m talking about are some more recent ones that EMS companies have recently discovered, while PCB technology has been evolving at such a rapid pace.
The technologies coming to our attention are:
- Wire bonding;
- Ribbon bonding;
- Die bonding;
- Extraordinarily fine-pitch 0.25-mm pitch BGAs;
- Buried resistance/buried capacitance; and
- Chip on board or CoB.
Editor's Note: This column originally appeared in the December 2013 issue of SMT Magazine.
04/29/2020 | Ranjan Chatterjee, Cimetrix Inc., and Dan Gamota, Jabil Inc.
Ranjan Chatterjee of Cimetrix and Daniel Gamota of Jabil teamed up to bring you this article, originally published as the paper "The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing."
03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.
11/06/2019 | I-Connect007 Editorial Team
Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.