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Valor's principle of consolidating data once then using it in multiple areas downstream, for example stencil design, pick and place programming and test machine programming, has now been extended to include X-ray inspection programming. Mark Laing explains how.
Watch the interview here.
Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.
I-Connect007 Editorial Team
Members of the I-Connect007 editorial team met with Andy Kadah, president of ICM Controls, and Kevin Jobsky, senior marketing manager, via teleconference on March 20, 2020. Originally, the purpose of our conversation was to discuss factory automation implementation details. Yet, we conducted the interview in the midst of a rapid-fire and wide-ranging onslaught of executive orders from the federal level on down to the local level meant to curb the spread of the coronavirus.
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.