Alpha & Enthone to Host LED Packaging Seminar in Taiwan

Reading time ( words)

Alpha, the world leader in the production of electronic soldering and bonding materials, will co-organize a half day Advanced LED Packaging Materials Seminar with Enthone, on June 17th during the LED Taiwan Lighting Exhibition being held at the Taipei World Trade Center. Both Alpha and Enthone are business units of Alent plc.

The free seminar focuses on emerging and advanced LED packaging technologies and will specifically focus on advanced LED packaging interconnect materials for a range of LED applications.  The Alpha and Enthone teams will cover the following key topics:

Light Output Improvement

• Sintered Silver Technology for High Thermal LED Die Attach
• Wafer Level Technologies for Flip-Chip LED Interconnect
• SMT Compatible Flip Chip Interconnect
• High Reflectivity Surface Chemistries for Light Output Improvement

Reliability

• High Creep Resistance Solder Alloys for Outdoor and Automotive Lighting

Enabling New Lighting Form Factors

• Compliant Interconnects for Flexible and 3D Lighting
• Interconnects for 3D Injection-molded Thermoplastics (MID)

Those in the LED community who would like more information on this seminar should contact  Ravi Bhatkal at rbhatkal@alent.com or Sam Chuang at schuang@alent.com.

To learn more about Alpha and our LED Technologies, please visit our site at alpha.alent.com.

About Alpha

Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes,  cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, visit www.alpha.alent.com.

02/08/2023 | Real Time with...IPC APEX EXPO

Nolan Johnson talks with Senior Product Manager Chris Nash of Indium Corporation, who discusses Durafuse LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.

01/11/2023 | Nolan Johnson, I-Connect007

Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

12/28/2022 | Andy Shaughnessy, I-Connect007

In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”