Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
BEST Releases IPC J-STD-001F Certification Soldering Kit
June 12, 2015 | BEST Inc.Estimated reading time: 1 minute
BEST Inc. announce the release of the of the IPC J-STD-001F certification soldering kit (click here) for hand soldering certification to the newest standard. This kit allows the trainer to administer training in both tin-lead and lead free RoHS compatible solders.
The BEST J-STD-001 training kit exceeds all of the minimum requirements of the J-STD-001 Revision F for soldering. It is an effective and cost-effective way to train and evaluate students and employees. This kit contains a variety of standard surface mount and throughhole components with traces to simulate real world situations. Each kit comes individually boxed with all components bagged and labeled for easy identification.
This solder training kit conforms to IPC J-STD-001E J standard for soldering. The kit is now in stock and ready to ship. Training center and bulk discounts are available.
Alex Conley from BEST Inc. reported “With the advent of Revision “F” of the J-STD-001 document the revised training requirements can be met with this revised solder certification training kit will be required for certification on the revised standard".
List price for this kit is $35.00 each.
About Business Electronics Soldering Technologies (BEST)
Headquartered in Rolling Meadows, Illinois BEST is a supplier of PCB rework and repair services as well as tools for those services in the communications, computer, industrial, automotive, avionic and military sectors. In addition BEST is a master IPC-certified training center certifying students and instructors in J-STD-001, IPC-610 and IPC 7711 and 7721 material.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.