Engineered Material Systems Introduces DF-3005

Reading time ( words)

Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3005 is available in other thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3005 film is tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature providing for chemical and moisture resistance. DF-3005 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.

DF-3005 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

For more information about the DF-3005 Dry Film Negative Photo Resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com. 

About Engineered Material Systems

Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

 

10/16/2019 | IPC

IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

09/18/2019 | I-Connect007

Meet Chris Ellis, one of our newest SMT007 columnists! In his columns, Ellis addresses common problems that Manncorp customers have had with the in-house conversion process, and shares solutions that have worked in the past.

09/05/2019 | Andy Shaughnessy, Design007 Magazine

I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.