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Dymax Releases "Dispensing Light-Curable Materials" White Paper
June 17, 2015 | Dymax CorporationEstimated reading time: 1 minute
Light-curable adhesives rapidly bond glass, metal, and plastic by curing upon exposure to energy of the proper wavelength. Many factors can affect the controlled dispensing and processing of these materials. Dymax Corporation’s new white paper “Dispensing Light-Curable Materials: Process Controls & Troubleshooting” discusses substrate compatibility, temperature and viscosity, and how to set up a dispense system. It also covers syringe dispensing challenges, air bubbles and cavitation in syringes, using cartridges and pressure pots, and preventive maintenance.
In manufacturing, process controls are used to ensure that products are made to the highest standard possible. When effective procedures are laid out for each step in the manufacturing process, it's much easier to reduce the risk of damage, failure, and loss. Register to download the paper and learn how to properly set up and maintain your dispensing system.
About Dymax Corporation
Dymax Corporation develops innovative oligomer, adhesive, coating, dispensing, and light-curing systems for applications in a wide range of markets. The company’s products are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiency and reduce costs. Major markets include aerospace, appliance, automotive, electronics, industrial, medical device, and metal finishing.
For additional information, visit www.dymax.com or contact Dymax Application Engineering at info@dymax.com or 860-482-1010.
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GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
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STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
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