Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
IWLPC Program Finalized and Registration Now Open
August 13, 2015 | SMTAEstimated reading time: 1 minute
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
The conference, held October 13 and 14, includes three tracks of technical paper presentations covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging. A strong lineup of plenary speakers and panelists from the world of 3D and MEMS was assembled to provide success stories and offer a glimpse of new and emerging technologies and applications.
Rama Alapati, Director of Package Architecture & Customer Technology (PACT) at GLOBALFOUNDRIES, is scheduled to give the keynote presentation the first day of the conference on “High Density Fan-Out: Evolution or Revolution.”
Sitaram Arkalgud, VP of 3D Technology at Invensas, will deliver the keynote on the second day, titled “2.5D/3D IC - Examining Low Cost Alternatives.”
The exhibition showcasing over 60 solutions providers covering everything from materials to equipment and market research to metrology will run concurrently with the conference on October 13 and 14. Though mostly sold out, a few booths still remain in the exhibition.
On Thursday, October 15, four application-oriented tutorials on Fan-Out Wafer Level Packaging, 3D ICs, Temporary Bonding of Electronics (Wafers, Displays, Devices), and Wafer Level Packaging for MEMS and Microsystems Technologies for Size and Cost Reductions will be instructed by experts in the field including Beth Keser, Ph.D., Qualcomm; John H. Lau, Ph.D., ASM Pacific Technology; Jared Pettit, Alex Brewer, Alman Law, and John Moore, DAETEC; and Leland "Chip" Spangler, Ph.D., Aspen Microsystems, LLC.
Visit http://www.iwlpc.com for more information.
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Chip Scale Review, now entering its 18th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.
Share on:
Suggested Items
L3Harris Receives $214 Million in Orders to Support German Armed Forces
05/12/2025 | L3Harris TechnologiesL3Harris Technologies has received multiple orders expected to total $214 million under Germany’s Digitalization – Land Based Operations (D-LBO) program.
Kaynes Technology Acquires Canada-Based August Electronics
05/09/2025 | PRNewswireAugust Electronics Inc. is pleased to announce that it has entered into a definitive agreement to be acquired by Kaynes Canada Limited, a wholly owned step-down subsidiary of Kaynes Technology India Limited, a leading Electronics System Design & Manufacturing (ESDM) company. The transaction is expected to close by the end of May 2025, subject to customary regulatory approvals and closing conditions.
LITEON Technology Reports Consolidated April Sales of NT$13.4 Billion Up 27% YoY
05/09/2025 | LITEON TechnologyLITEON Technology reported its April consolidated revenue of NT$13.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 27% YoY.
Ultrahuman Expands its American Factory’s Manufacturing Capacity
05/09/2025 | GlobeNewswireUltrahuman, a pioneer in health optimization technology, has announced that it’s ramping up its capacity of the Ring AIR. Ultrahuman’s manufacturing facility (UltraFactory) in partnership with SVtronics, a US-based electronics manufacturing business, has been operational in Plano, Texas, since November 2024.
Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
05/08/2025 | BUSINESS WIREQuadric announced that Kyocera Document Solutions Inc. (hereinafter: Kyocera) has licensed the Chimera™ general purpose neural processor (GPNPU) intellectual property (IP) core for use in next generation office automation system on-chip (SoC) designs.