Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Mobileye, Mahindra to Explore Next-Generation Advanced Driving Technology

01/09/2024 | BUSINESS WIRE
Mobileye, a pioneering, AI-powered Advanced Driver Assistance Systems (ADAS) technology company, is expanding its existing relationship with Mahindra & Mahindra Ltd. (M&M), a leader in automotive, farm and services businesses. Mobileye will collaborate with M&M to introduce multiple solutions based on Mobileye's next-generation EyeQ 6 systems-on-chip and sensing and mapping software, including an intent to build a full-stack autonomous driving system.

Ansys Collaborates with Sony Semiconductor Solutions to Advance Next-Generation Simulation of Automotive Image Sensors

11/10/2023 | PRNewswire
Ansys collaborated with Sony Semiconductor Solutions (Sony) to enhance high-fidelity image sensor simulation and camera-based features in next-generation automotive applications, including AV and ADAS.

indie Semiconductor Launches Breakthrough Computer Vision Processor

10/24/2023 | indie Semiconductor
indie Semiconductor, an Autotech solutions innovator, has expanded its automotive camera video processor portfolio with the commercial release of iND87540, a highly integrated system-on-chip (SoC) that enables viewing and sensing capability at the vehicle’s edge.

Ansys Enables Flexium's 5G mmWave Antenna Module Designs to Advance ADAS/AV Technology

07/13/2023 | PRNewswire
Flexium uses Ansys simulation solutions to explore design ideas, and develop and test antenna modules for high-frequency signal transceiver designs used in advanced driver assistance systems (ADAS) and autonomous vehicle (AV) applications.

Rise of High-Performance TIMs in ADAS and Data Centers, Reports IDTechEx

04/05/2023 | PRNewswire
Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase change materials.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in