-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ESCATEC Solves Problem of Overheating High Brightness LEDs
September 7, 2015 | ESCATECEstimated reading time: 1 minute
ESCATEC, one of Europe's leading providers of contract design and manufacturing services, will be launching its solution to the challenge of effectively cooling high brightness LEDs on its stand E8 at the LED Professional Symposium 2015 in Bregenz, Austria on 22-24 September 2015.
ESCATEC's Heat Spreader solution solders the LEDs onto a copper substrate, which is up to ten times more effective at dissipating the heat generated by the LEDs than current solutions. The CoolRunning design means that LEDs with a power density of up to 10W per mm2 could be passively cooled.
The Heat Spreader was developed in response to a customer visit to ESCATEC's FutureLab where novel and innovative solutions are developed for LED applications. "Heat dissipation is always a challenge for LEDs as their compact size means that the LEDs can be packed close together to form a powerful illumination source but that also forms a highly concentrated heat source, for example, when a hundred 5 Amp LEDs are side by side," explained Wolfgang Plank, Manager of the FutureLab. "Our novel Heat Spreader solution opens up compact, high power LEDs of, say 1000W, to be used in many new applications such as stage lighting, architectural illumination and video projectors."
By starting from the bare LED die, ESCATEC can customise the solution with regards to the size of the package, the shape of the beam so that there are minimal losses, and the wavelength of the light along with its intensity. This freedom of design enables the LED solution to be highly efficient, appropriately cooled and optimised for the required power consumption. It also enables the lens or lens array to be custom made to provide the exact optics required by the application and ensures that design can be compact with high optical efficiency.
About ESCATEC
The ESCATEC Group provides fully-integrated electronic and mechatronic design and manufacturing solutions to assist customers in achieving success in their market. Its one-stop solutions and best-in-class service enable companies around the world to operate more profitably, sustainably and efficiently. Founded in 1984, its history is full of innovation, which made it a first choice partner for many European and North American OEMs. The Swiss-owned company perfectly blends Swiss business philosophy and attention to quality, precision and detail with the advantage of low-cost, mass-volume manufacturing capabilities in its Asian factories.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.