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Dymax White Paper Explains Switching from Conventional Lamp to LED Light-Curing Sources
November 23, 2015 | Dymax CorporationEstimated reading time: 1 minute
Dymax Corporation’s new white paper, Ensuring Success When Switching from Conventional Lamp to LED Light Curing Sources, discusses topics such as how LED curing works, the advantages to LED curing, and getting enough information to switch successfully. LEDs, or light emitting diodes, continue to gain popularity as a replacement for traditional light bulbs, not only in homes and public buildings, but also for use with light-curable materials (LCMs). Because of the differences in the technology, making the switch from broad spectrum to LED-curing energy sources is seldom a matter of simply replacing conventional lamps with LED units.
Success when switching to an LED system depends on careful consideration of all the factors involved, from the LCM to the curing unit selected for the application. With attention to detail and proper compatibility of all components, along with sufficient adjustments to manufacturing processes, it is certainly possible to enjoy a smooth transition to the benefits of LED light-cure technology. To find out how, download the white paper at www.dymax.com.
Dymax Corporation develops innovative oligomer, adhesive, coating, dispensing, and light-curing systems for applications in a wide range of markets. The company’s products are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiency and reduce costs. Major markets include aerospace, appliance, automotive, electronics, industrial, medical device, and metal finishing.
For additional information, visit www.dymax.com or contact Dymax Application Engineering at info@dymax.com or 860-482-1010.
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Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
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