-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Four Industry Volunteers Receive IPC Rising Star Award
March 28, 2016 | IPCEstimated reading time: 2 minutes

In recognition of their leadership roles and support to IPC standards, education, advocacy and solutions to industry challenges, four of industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2016. There award recipients were: Steven Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati; Stan Rak, Continental Automotive GmbH; Matt Turpin, Zentech Manufacturing; and Peter Zhou, Huawei Technologies Co., Ltd.
Bowles was honored for his leadership of the 2-30 Terms and Definitions Committee that recently issued IPC-T-50M and membership on nearly 20 additional technical committees, including the Committee Chairman’s Council and the Technical Activities Executive Committee.
Also honored, Rak was recognized for strengthening ties between IPC and Continental as well as the automotive industry and European region at large. He aligned Continental’s locations for an IPC corporate membership, acted as coordinator for Continental’s IPC training initiatives, and is encouraging Continental’s global technical experts to contribute to IPC Standards Working Groups.
The third recipient, Turpin, earned a Rising Star Award for his contributions to the Government Relations Steering Committee, active attendance at IPC’s annual GR event, IMPACT, hosting Congressman Chris Van Hollen at Zentech’s manufacturing facility in Baltimore and leading the company’s pursuit of the first ever qualified manufacturer listing to the IPC J-STD-001 Space Addendum and IPC J-STD-001 AND IPC-A-610 QML under IPC’s Validation Services Program.
Zhou was honored for his leadership of the IPC-1401 standard technical group which has been tasked with developing supply chain social responsibility management guidance. As part of his chairmanship, Peter invited 160 expert volunteers from 10 industry associations and 80 electronics manufacturing companies to join the group and facilitated 8 group meetings in two years to develop the standard. Currently IPC-1401 is in the final review stage with balloting expected within a month or two. The standard will be released later this year.
“IPC and the entire electronics industry are fortunate to have these dedicated individuals volunteer their time and expertise to IPC standards and program development,” said John Mitchell, IPC president and CEO. “Their leadership and work has enriched both the industry and IPC within the past five years and will continue to have a lasting impact for many years to come.”
For more information on the IPC Rising Star Award and this year’s award recipients, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Our Legislative Outlook: PCB007 Magazine October 2025 Issue
10/16/2025 | I-Connect007 Editorial TeamMost agree that we are experiencing an unprecedented time in global business and economics, with rules and laws that open doors to business but can complicate operations and make profitability more challenging. This month, PCB007 Magazine features some of today’s leading experts on legislative issues affecting the electronics industry, including rules and laws, trade, sustainability, business expansion, grants, and more in the U.S., Europe, and China.
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.