Latest News



VIAVI, Hanyang University Sign Memorandum of Understanding to Advance 6G Research
06/10/2025 | PRNewswire


VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
06/09/2025 | BUSINESS WIRE





Tariff Effects and China Subsidies Soften 1Q25 Downturn; Foundry Revenue Decline Narrows to 5.4%
06/09/2025 | TrendForce




Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMS




GigaDevice Anchors Global Headquarters in Singapore to Power Synergy and Impact
06/05/2025 | GigaDevice


New Companion Guide to ‘DFM Essentials’ Delivers Deeper, Practical PCB Design Insights
06/09/2025 | I-Connect007

Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.

Growing Demand for Mid-Size Displays Opens New Opportunities for FMM-Free OLED Technologies
06/05/2025 | TrendForce


GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
06/04/2025 | GlobalFoundries

Siemens Announces PAVE360 Support for New Arm Zena Compute Subsystems
06/04/2025 | Siemens Digital Industries Software


New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
06/04/2025 | PRNewswire

IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
06/03/2025 | IIT Kharagpur
DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot
06/03/2025 | TrendForce
Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications
06/02/2025 | Elma Electronic
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer Burger
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIRE
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium Corporation
Huawei Single SitePower Solution Creates Four Synergies to Accelerate Site Intelligence
05/27/2025 | PRNewswire
AI Demand Fuels Enterprise SSD Growth; 3Q25 NAND Flash Prices Likely to Rise Further
05/27/2025 | TrendForce
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
05/26/2025 | ClassOne Technology
Hitachi Energy, Statnett to Deliver Norway’s First Eco-Efficient Transmission Grid Connection Solution
05/26/2025 | Hitachi Energy
TI Teams with NVIDIA to Bring Efficient Power Distribution to AI Infrastructure
05/26/2025 | Texas Instruments
AI Demand Fuels Enterprise SSD Growth; 3Q25 NAND Flash Prices Likely to Rise Further
05/26/2025 | TrendForce
Qualcomm, Xiaomi Expand Collaboration with Multi-Year Agreement
05/23/2025 | Qualcomm Technologies, Inc.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForce
TRUMPF Electronics Announces the Opening of a Technical Center in Southeast Asia
05/22/2025 | TRUMPF Electronics
STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology
05/22/2025 | STMicroelectronics
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundries
Foxconn, Thales Group Announce Strategic Partnership in Semiconductor and Space
05/20/2025 | Foxconn
ICEYE, Safran Announce Strategic Partnership on Persistent Surveillance Capabilities
05/20/2025 | PRNewswire
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca Technologies
Keysight Quantum Control System Embedded within Fujitsu and RIKEN’s World-Leading 256-Qubit Quantum Computer
05/16/2025 | BUSINESS WIRE
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
05/15/2025 | BUSINESS WIRE
Indian Government Establishes Panel for New National Manufacturing Mission
05/14/2025 | I-Connect007
KEC International Lands New Orders, Including Semiconductor Breakthrough
05/14/2025 | KEC International
Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity
05/14/2025 | BUSINESS WIRE
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial Team
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
05/12/2025 | BEST Inc.
Cadence, AVCC to Advance Physical AI Innovations for Autonomous Vehicles
05/12/2025 | Cadence Design Systems
Industrial Robotics Market is Set to Surpass Valuation of $235.38 Billion by 2033
05/12/2025 | Globe Newswire
Apple Announces Plans to Add AI Search to Safari, Potentially Threatening Google’s Ad Revenue
05/09/2025 | I-Connect007 Editorial Team
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechEx
Primech AI Plans Production of 300 HYTRON Robots through its China Manufacturing Expansion
05/09/2025 | Globe Newswire
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP Semiconductor
LG Electronics India Limited Begins Construction of Its Third Manufacturing Plant in India
05/08/2025 | BUSINESS WIRE
German Government Issues Final Funding Approval For New Infineon Fab In Dresden
05/08/2025 | Infineon
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design Systems
OLED Monitor Shipments Surge 175% YoY in the First Quarter; ASUS Rises to Second Place
05/08/2025 | TrendForce
Ericsson, Nokia, ANDREW, and Huawei Take Top Spots in ABI Research’s DAS/DRS Vendors Competitive Ranking
05/07/2025 | ABI Research
U.S. Tariff Uncertainty and Weakening Demand Pose Major Risks to 2H25 MLCC Market
05/07/2025 | TrendForce
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma Electronic
$1 Million Awarded to Galvanize Workforce with Electronics Education
05/05/2025 | University of Arkansas
DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand
05/05/2025 | I-Connect007 Editorial Team
Hon Hai Research Institute Demonstrates Superiority of Shallow Quantum Circuits Beyond Prior Understanding
05/05/2025 | Hon Hai Technology Group
Commerce Secretary Howard Lutnick Visits TSMC Arizona Fabrication Facility for Third Fab Ground Breaking
05/02/2025 | U.S. Department of Commerce
MICROOLED Announces Partnership with Vortex Optics and Brand New US Headquarters
05/02/2025 | BUSINESS WIRE
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design Systems
Siemens Expands Global Electronics Intelligence Reach and Supplyframe Portfolio with Wevolver Acquisition
04/30/2025 | Siemens Digital Industries Software
TV Brands May Pass U.S. Tariff Costs to Consumers; 2025 Shipments Expected to Drop 0.7%
04/30/2025 | TrendForce
Microsoft’s Brad Smith Urges U.S. Leadership in Quantum Technology
04/29/2025 | I-Connect007 Editorial Team
Machine Vision: MVTec Expands Deep Learning Portfolio with New Versions of its Deep Learning Tool
04/29/2025 | MVTec Software GmbH
Visteon, Qualcomm Redefine Next-Generation AI-based Intelligent Cockpit Experience
04/28/2025 | PRNewswire
New IDTechEx Report Examines How QLC SSDs Are Disrupting the HDD Storage Market
04/24/2025 | PRNewswire
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/30/2025 | I-Connect007
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial Team
Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
04/23/2025 | BUSINESS WIRE
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