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Keysight Signs Virtual Power Purchase Agreement for Renewable Energy Development
New Today | BUSINESS WIRE
Hitachi Energy Expands and Increases Workforce in Composite Component Factory in Piteå, Sweden
New Today | Hitachi Energy
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
New Today | GlobalFoundries
Singular Photonics Emerges from Stealth with Portfolio of SPAD-based Image Sensors
01/23/2025 | PRNewswire
Laser Photonics Introduces Comprehensive Channel Partner Program for Streamlined Collaboration
01/21/2025 | BUSINESS WIRE
U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera
01/21/2025 | U.S. Department of Commerce
Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center
01/20/2025 | U.S. Department of Commerce
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of Commerce
New JH Technologies Partnership Expands Focus on Scanning Electron Microscopes
01/17/2025 | PRNewswire
MKS Instruments Receives 2024 Supplier Excellence Award for Innovation from Onto Innovation
01/16/2025 | MKS Instruments, Inc.
Gartner Says Worldwide PC Shipments Increased 1.4% in Q4 2024 and 1.3% for the Year
01/16/2025 | Gartner, Inc.
AI Infrastructure to Dominate MLCC Demand in 2025 amid Persistent Oversupply Challenges
01/16/2025 | TrendForce
U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
01/16/2025 | U.S. Department of Commerce
Biden-Harris Administration Awards Additional $210 Million Tech Hub Grants
01/14/2025 | U.S. Department of Commerce
Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
01/13/2025 | BUSINESS WIRE
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
01/13/2025 | U.S. Department of Commerce
Global Robot LLM Market to Exceed $100B by 2028, NVIDIA’s WFM Platform to Drive Growth
01/13/2025 | TrendForce
Honda, Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles
01/10/2025 | JCN Newswire
Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
01/10/2025 | Qualcomm Technologies, Inc.
TI Launches New Edge AI-enabled Radar Sensor and Automotive Audio Processors
01/10/2025 | Texas Instruments
Siemens, Sony Deliver Breakthrough Immersive Engineering for the Industrial Metaverse
01/09/2025 | Siemens Digital Industries
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
01/09/2025 | U.S. Department of Commerce
ChipAgents Achieves State-of-the-Art Results on NVIDIA's VerilogEval Benchmark
01/08/2025 | PRNewswire
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of Commerce
GlobalLogic, Hitachi Systems Trusted Cyber Management Open Cutting-Edge Security Operations Center in Poland
01/08/2025 | BUSINESS WIRE
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
01/07/2025 | PRNewswire
Ansys, Synopsys Announce Agreement with Keysight Technologies for Sale of Ansys PowerArtist
01/07/2025 | PRNewswire
MANA Develops Ferroelectric-ferromagnetic Materials for Next-generation Electronics
01/07/2025 | PRNewswire
Biden-Harris Administration Awards SRC $285M for New CHIPS Manufacturing USA Institute for Digital Twins
01/07/2025 | U.S. Department of Commerce
HaiLa Technologies Releases Extreme Low-Power Development Platform for Wi-Fi Communications
01/06/2025 | BUSINESS WIRE
GlobalFoundries, IBM Announce Settlement and Resolution of All Litigation Matters
01/03/2025 | GlobalFoundries
Tata Elxsi to Accelerate SDV Adoption With Qualcomm's Snapdragon Automotive Platforms
01/03/2025 | PRNewswire
Universal Electronics Inc. Expands UEI TIDE Family Portfolio with New Features and Capabilities
01/02/2025 | BUSINESS WIRE
ONDA Sets up Joint Venture in UAE to Speed up Expansion into the Middle East
01/01/2025 | BUSINESS WIRE
Knowles Completes the Sale of Its Consumer MEMS Microphone Business to Syntiant
01/01/2025 | BUSINESS WIRE
Universal Electronics Unveils Revolutionary QuickSet homeSense Technology at CES
01/01/2025 | BUSINESS WIRE
Littelfuse Completes Acquisition of the 200mm Wafer Fab Located in Dortmund, Germany
01/01/2025 | BUSINESS WIRE
Rising Inventories and Weak Seasonal Demand May Push 1Q25 NAND Flash Prices Down by Over 10%
01/01/2025 | TrendForce
Logitech Named to Dow Jones Sustainability Europe Index for Fifth Consecutive Year
12/31/2024 | BUSINESS WIRE
2025 Will See Significant Growth in AI Spending, But Gen AI Will Not Create Expected Value
12/31/2024 | ABI Research
Passive Buyer Strategies Drive DRAM Contract Prices Down Across the Board in 1Q25
12/30/2024 | TrendForce
$100M Investment Will Propel Absolics, Georgia Tech’s Advanced Packaging Research
12/30/2024 | Georgia Tech
Japan's Telecommunications Carriers Join Forces to Strengthen Disaster Response
12/30/2024 | JCN Newswire
'Qualcomm AI Program for Innovators' Launched to Foster On-Device AI Innovation in the Asia-Pacific Region
12/27/2024 | Qualcomm Technologies, Inc.
PFN, MC and IIJ to Establish Joint Venture Preferred Computing Infrastructure for AI Cloud Computing
12/27/2024 | Mitsubishi Corporation
Green Tech Accelerator: Tackling Water Resource Challenges and Unlocking Renewable Energy Opportunities
12/26/2024 | BUSINESS WIRE
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of Commerce
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas Instruments
The 500 Largest Cellular IoT Deployments Together Account for 632 Million Units
12/23/2024 | Berg Insight
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of Commerce
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of Commerce
CHIPS Act Funds SK hynix's $3.87 Billion Investment in U.S. Semiconductor Supply Chain
12/19/2024 | U.S. Department of Commerce
GlobalFoundries Sets New Bar as Largest Semiconductor Company to Protect Innovation by Joining LOT Network
12/19/2024 | GlobalFoundries
SandboxAQ Announces More Than $300 Million of Funding to Drive Next Era of AI
12/19/2024 | PRNewswire
Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers
12/18/2024 | U.S. Department of Commerce
Honeywell, Sino Jet Expand Collaboration With New Memorandum Of Understanding
12/17/2024 | Honeywell
Successful Pre-acceptance of TSK Schill GmbH Production Line for Moulded Etched Parts
12/16/2024 | TSK Schill GmbH
Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components
12/13/2024 | U.S. Department of Commerce
Coherent Evaluates Strategic Alternatives for Its Advanced Lithium-Ion Battery Recycling Technology
12/13/2024 | Globe Newswire
Mobile Robots Set to Reach 2.8 Million Shipments by 2030 as Applications Expand Across Industries
12/13/2024 | ABI Research
Keysight Joins Intel Foundry Accelerator United States Military, Aerospace and Government Alliance
12/13/2024 | Keysight Technologies, Inc.
Burkle's Marco Schaible Joins VDMA Photovoltaic Equipment Division’s Executive Board
12/13/2024 | Burkle America
Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects
12/12/2024 | U.S. Department of Commerce
Quantum Leaps: Winners of Airbus and BMW Group’s Quantum Computing Challenge Unveiled
12/12/2024 | BUSINESS WIRE
STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers
12/11/2024 | STMicroelectronics
Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris
12/06/2024 | U.S. Department of Commerce
Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs
12/06/2024 | TrendForce
enSights Raises $10M to Scale its AI-Powered Clean Energy Optimization Business
12/05/2024 | PRNewswire
iSQUARED Expands Specialized Material Offerings Validated for Stratasys 3D Printers
12/03/2024 | BUSINESS WIRE
ROHM Semiconductor, Valeo Co-Develop the Next Generation of Power Electronics
12/03/2024 | Globe Newswire
AR, Automotive Applications to Drive Micro LED Chip Revenue to $489.5 Million by 2028
12/03/2024 | TrendForce
AI and Interactive Demand to Drive Humanoid Robot Market Value Beyond $2 Billion by 2027
12/01/2024 | TrendForce
Enterprise SSD Demand Soars While Consumer Orders Lag, Driving 3Q24 NAND Flash Revenue Up 4.8%
11/29/2024 | TrendForce
Siemens’ Solido SPICE Now Certified for Multiple Leading-edge Samsung Foundry Processes
11/27/2024 | Siemens Digital Industries Software
Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity
11/27/2024 | U.S. Department of Commerce
Heilind Asia Pacific Awarded 2024 'Best Strategic Account Development' by TE Connectivity
11/25/2024 | GlobeNewswire
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