Latest News

Fiona Lam Appointed as CFO for the Agfa-Gevaert Group
10/21/2024 | Agfa-Gevaert
TPCA Show 2024 Highlights Taiwan-Thailand Industry-University Collaboration
New Today | TPCA
Cicor Consolidates Thin-film Technology Business in Wangs
10/18/2024 | Cicor
OTC Markets Group Welcomes Firan Technology Group Corporation to OTCQX
10/17/2024 | Globe Newswire
Calumet Electronics Leads US Organic Substrate Technology Innovation with KLA Corporation
10/17/2024 | Calumet Electronics
Young Expert 'Cleanroom Ralph' Explains Microelectronics for AT&S
10/17/2024 | AT&S
CIMS to Showcase Advanced Solutions at TPCA 2024
10/17/2024 | CIMS
PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial Team
Cicor Group Continues to Thrive in a Challenging Market
10/15/2024 | Cicor
iNEMI Packaging Tech Topic Webinar: Navigating Advanced IC Substrate Technology and Market Trends
10/15/2024 | iNEMI
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User Group
Ventec Promotes Bill Wang to Group Technical Vice President
10/14/2024 | Ventec
CEE PCB Appoints Johnny Gutierrez Regional Sales Manager
10/14/2024 | CEE PCB
DuPont Announces Two Technology Leaders as DuPont Laureates
10/11/2024 | PRNewswire
FTG Announces Q3 2024 Financial Results; Revenues Up 18%
10/10/2024 | Firan Technology Group Corporation
Ventec Consolidates and Upgrades European Production and Logistics Center in Germany
10/10/2024 | Ventec
Confidee Continues to Strengthen Defense Supply Chains Through AS9120 Certification Compliance
10/10/2024 | CONFIDEE
Zhen Ding Technology Reports Record Revenue and Profitability in Q3 2024
10/09/2024 | Zhen Ding Technology
Site Consolidation at Würth Elektronik
10/09/2024 | Wurth Elektronik
I-Connect007 Launches Latest Podcast Series: Meet the Author
10/09/2024 | I-Connect007
OKI to Exhibit High-Reliability PCBs for Aerospace, Defense, and Telecommunications at PCB West 2024 in USA
10/08/2024 | BUSINESS WIRE
October Issue of Design007 Magazine: Partial HDI
10/08/2024 | I-Connect007 Editorial Team
KLA Completes First Phase of US$200 Million Singapore Operations Expansion
10/04/2024 | KLA
Indian PCB Market Projected to Reach $20.17 Billion by 2032
10/05/2024 | openPR
TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation
10/04/2024 | TAIFLEX Scientific Co. Ltd
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
10/01/2024 | U.S. Department of Defense
American Standard Circuits and Sunstone Now Offering Online Flex PCB Quoting
10/01/2024 | American Standard Circuits
Bowman Signs Distribution Agreement with Nireco for Bowman's XRF Measurement Instruments in Japan
09/30/2024 | Bowman
CIMS to Showcase Advanced Solutions at TPCA 2024
09/30/2024 | CIMS
AT&S CEO Function to Be Newly Advertised
09/30/2024 | AT&S
Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
09/27/2024 | Aismalibar
Amphenol Trackwise to Exhibit at electronica 2024
09/27/2024 | Amphenol Trackwise
American Standard Circuits to Exhibit at SMTA International Conference and Expo
09/26/2024 | American Standard Circuits
TTM Technologies Wins Cisco 2024 Supply Chain Security Champion Award
09/26/2024 | Globe Newswire
Nano Dimension to Acquire Markforged, Leading AM Player
09/26/2024 | Nano Dimension
Welcome Day: AT&S Trains 21 New Apprentices for the High-tech Industry
09/26/2024 | AT&S
AT&S Successfully Completes Transaction for Ansan Plant in South Korea
09/25/2024 | AT&S
Excellon Automation to Exhibit at AEMS 2024
09/25/2024 | Excellon Automation
North American PCB Industry Sales Up 35% in August
09/23/2024 | IPC
iNEMI Announces End-of-Project Webinar for PCB Connector Footprint Tolerance Project
09/23/2024 | iNEMI
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