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Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
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In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication.
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New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
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Latest News

MacDermid Alpha to Revolutionize mSAP with New HDI Compatible Low Etch Direct Metallization Processes
09/25/2020 | Jason Fullerton, MacDermid Alpha Electronics Solutions



Ventec Launches High-Speed Material Option Cladded with Thin-Film Resistor Foil
09/24/2020 | Ventec International Group


CCI Canadian Circuits Supporting Medical Equipment Manufacturing During COVID-19 Pandemic
09/22/2020 | CCI Canadian Circuits Inc.

Burkle North America Announces Headquarters Move to Greensboro Technology Center
09/21/2020 | Burkle North America





PCB Manufacturer Ilfa Feinstleitertechnik Invests in New Electrical Test and AOI
09/16/2020 | ADEON Technologies




Hitachi High-Tech Launches EA1400 RoHS Analyzer for Hazardous Substance Control
09/15/2020 | Hitachi High-Tech Analytical Science America




Ventec Strengthens Growing US and Mexican Market with New Sales Representative
09/14/2020 | Ventec International Group

Minco Introduces S7 and TC7 Tri-Certified Miniature Embedment Temperature Sensors
09/11/2020 | Minco Products Inc.



Board Shark PCB Enters the U.S. Southwest Market with ARK Manufacturing
09/09/2020 | Board Shark PCB
Sumitomo Electric Mass Producing Fluororesin-based Flexible Printed Circuits
09/07/2020 | Sumitomo Electric Industries, Ltd.
I-Connect007 Releases Exclusive Coverage of 2020 IPC High-Reliability Virtual Forum
09/04/2020 | I-Connect007 Editorial Team
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