Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Technica USA to Present Full Line of Products at IPC APEX Expo
February 6, 2017 | Technica USAEstimated reading time: 1 minute
Technica USA plans to present their full line of material and equipment products for both the PCB fabrication and SMT segments of their business at the 2017 IPC APEX Expo in booth #3449.
In the PCB fabrication portion of their booth, Technica will be featuring Chime Ball Technolgy’s (CBT) latest in Maskless Lithography technology, the Raptor 7000 Series. This technology is already being purchased and placed within the United States. A demonstration on the attributes of this technology will be conducted throughout the expo. In addition, they will be featuring three new products recently released by Elite Materials Company (EMC). These are the halogen free EM890 and the halogenated EM891 ultra high speed materials for 100 and 200GbE applications, as well as the EM 370Z, a halogen free very low CTE material for automotive and EV/HEV applications. Technica will also be promoting a variety of leading products from their other PCB fab partners including Fuji Film, Grace Electron, RBP Chemicals, Electra Polymers, Elga and Hitachi Dry Film, Kyocera Precision Tools, Wise Process Equipment, PAL, Teknek, CJI Process Systems, DMP Waste & Water Treatment Systems and Shurloc Fabric Systems.
On the SMT side of the booth, Technica will be featuring more equipment than in previous years. They will again be featuring the E by SIPLACE placement equipment from ASM Assembly Systems. The introduction of this equipment last year was welcomed with great success and is anticipated to have even greater success in 2017. This year, Technica will introduce the new E by DEK, a low-cost screen printer for solder paste applications from ASM. The combination of the E by SIPLACE and the E by DEK will provide mid volume manufacturers with unprecedented performance and flexibility at an affordable cost. They will also be demonstrating the new Teknek SMT surface cleaner along with a double-sided laser marking unit and a standard in line conveyor from YJ Link, a company offering a complete line of handling equipment for PCB assembly.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and assembly markets as well as the microelectronic, photovoltaic and printed electronics markets. For more information on Technica, USA, please contact Jason Perry at 1-408-240-5950 or click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.