It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Orbotech Presented Ultra Dimension Series at HKPCA 2017
December 28, 2017 | OrbotechEstimated reading time: 3 minutes
Orbotech Ltd. presented its new Ultra Dimension AOI (Automated Optical Inspection) series at the recent PCB industry HKPCA 2017 show in Shenzhen, China. The Ultra Dimension was showcased in a model AOI room along with the Precise 800 AOS (Automated Optical Shaping), remote multi-image verification (RMIV) station and Orbotech Data Server, attracting approximately 500 visitors during the three days of the show. In addition, Orbotech also presented its Nuvogo Fine Direct Imaging solution, as well as Orbotech Smart Factory solution for Industry 4.0 and Frontline’s CAM and Engineering solutions.
Designed to meet the rigorous demands of advanced PCB manufacturing using SLP/mSAP (substrate-like PCB/modified semi-additive process), the innovative Ultra Dimension is the first AOI solution to integrate four leading systems into one. The solution, which includes pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology, signifies a revolution in the AOI room workflow and enables manufacturers to increase quality and yield while dramatically reducing their overall total cost of ownership (TCO).
“Orbotech’s new AOI room concept together with our new Ultra Dimension, attracted positive attention at HKPCA,” commented Hadar Himmelman, President of Orbotech Pacific. “The feedback that we received on our new 4-in-1 AOI solution is that it represents a real revolution in the AOI room workflow. Together with its ability to reduce TCO, the Ultra Dimension meets our customers’ needs as the market becomes more sophisticated.
”Ultra Dimension’s combination of high precision and high quality pattern inspection and laser via (LV) inspection in a single scan is powered by Orbotech’s proprietary Triple Vision Technology and Magic Technology. By using varied light settings and three different types of images, these technologies enable Ultra Dimension to improve detection capabilities significantly, reduce false alarms and decrease inspection set-up time. This, in turn, allows manufacturers of advanced PCBs using SLP/mSAP (substrate-like PCB/modified semi-additive process) the flexibility to inspect a variety of applications and materials, and eliminates the need to use inspection masks which can cause defects to be overlooked.
Orbotech’s 2D metrology automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling the higher accuracy and impedance control necessary for SLP/mSAP as well as advanced HDI applications.
Orbotech’s Remote Multi-Image Verification (RMIV) enables the remote verification of multiple image defects, which are automatically and simultaneously acquired during the inspection process. Orbotech’s unique multi-image technology enables operators to accurately differentiate between real and false defects, which are then sent to offline RMIV stations. Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up valuable floor space in the AOI room and allowing manufacturers to cut their overall labor and operational costs significantly.
For the second year running, Orbotech won a prize for booth design from the HKPCA Association. The prize was awarded at a gala dinner event during the show.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality (‘reading’); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces (‘writing’); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing (‘connecting’). Orbotech refers to this ‘reading’, ‘writing’ and ‘connecting’ as enabling the ‘Language of Electronics’. For more information, click here.
Share on:
Suggested Items
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
11/25/2024 | Real Time with... electronicaIn this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.
TRI’s SEMI and SMT Inspection Solutions at NEPCON Japan 2025
11/15/2024 | TRITest Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, will join NEPCON Japan 2025, held at Tokyo Big Sight from January 22 – 24, 2025.
ViTrox Strengthens Its Mexico Presence with New Demo Room and Strategic Workforce Expansion
11/07/2024 | ViTroxYear 2024 marks a significant year of growth for ViTrox in Mexico. In collaboration with SMTo, ViTrox has successfully established a state-of-the-art demo room, enhancing its capabilities to deliver advanced solutions to customers. As part of its commitment to the region, ViTrox is also expanding its local workforce, underscoring its dedication to innovation and service excellence in Mexico’s thriving market.
iNEMI End-of-Project Webinar: Investigation of AI Enhancement to AOI for PCBA
11/06/2024 | iNEMIAutomated optical inspection (AOI) systems are essential in electronic manufacturing for ensuring the quality of printed circuit board assemblies (PCBAs).
ViTrox Showcases Groundbreaking Inspection Innovations at NEPCON Asia 2024
10/30/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its participation in NEPCON Asia 2024. The event will be held at Shenzhen World Exhibition & Convention Center (Bao’an) from November 6th to 8th at Hall 9, Booth #9E20.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in