It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Atotech Launches Next Revolution in Electroless Copper for Advanced FPCB
September 3, 2018 | AtotechEstimated reading time: 2 minutes
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating. The new process, Printoganth RA, is compatible with electro-deposited copper (ED), rolled and annealed (RA) as well as “super-flexible RA” (HA) copper foils and best suited to meet OEM requirements for mobile applications.
Image Caption: Printoganth RA – Shiny surface appearance after electrolytic copper plating moderated growth of copper crystals.
RA copper foils are most commonly used for the metallization of next generation flexible substrates. Their special crystal structure, particularly for the “super flexible” HA copper foils, however, requires sophisticated plating solutions in order to achieve the desired surface morphology. One major challenge is the surface appearance after the electrolytic copper plating step. The surface has to have a certain shiny appearance, in order to enable an even etching during structuring and to ensure a reliable automated optical inspection (AOI). In order to overcome this challenge and offer a technically sound solution the Atotech team developed the new Printoganth RA process that complies with different materials when plating advanced flexible and flex-rigid PCBs.
Phenomenal Throwing Power Meets Excellent Coverage with Good Adhesion
Printoganth RA features an excellent coverage on all relevant base materials, including FR4, PI and PI adhesives. A phenomenal throwing power of more than 70% into blind micro vias (BMV) enables good coverage and thicker electroless copper deposits, also at critical spots such as the BMV corners or on exposed adhesive layers within vias. Due to its favorable internal stress characteristics, Printoganth RA allows for an excellent and blister free adhesion of the electroless deposited copper layer even on smooth substrates like PI.
Customer Verification
“Extensive tests at customer sites have confirmed the outstanding performance of Printoganth RA,” states Lars-Eric Pribyl, global product manager for desmear and metallization at Atotech Group. “Already today, two leading manufacturers of FPCBs for next generation smartphones are currently using the Atotech process, which is favored by leading smartphone OEMs. It is the combination of higher process safety thanks to higher throwing power and higher yield rates due to the shiny surface after electroplating that convinced them.”
About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries. For more information, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.