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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EIPC SpeedNews: News from the European PCB Industry
December 24, 2018 | EIPCEstimated reading time: Less than a minute

- Interview Technical Director Tarja Rapala-Virtanen by Pete Starkey, PCB007
- Call for abstract submission for MicroTech 2019
- Greensource Fabrication LLC Announces Acquisition AWP Group GmbH
- Ventec Extends tec speed 20.0 Series of Low PIM Antenna-Grade Laminates
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Wolfspeed Announces Executive Leadership Change
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TDK Demonstrates the World's First ‘Spin Photo Detector’ Capable of 10X Data Transmission Speeds for the Next Generation of AI
04/16/2025 | PRNewswireThis new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption.
Nano Dimension’s Essemtec Product Line Unveils FOX Ultra and PUMA Ultra, the Next Generation of High-Performance SMT Solutions
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