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SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade

05/06/2025 | SolderKing
SolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.

Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

KOKI Expands U.S. Sales Coverage with Multiple New Representatives

04/29/2025 | KOKI
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.

SMTA Bridging the Skills Gap in Arizona

04/24/2025 | Marcy LaRont, I-Connect007
One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

04/23/2025 | IPC
IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.
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