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Royal Circuits Expands Flex Capabilities with Brand New Facility
March 15, 2019 | Royal CircuitsEstimated reading time: 1 minute
Royal Circuits, a global manufacturer of high technology printed circuit boards, has completed the expansion of its flex division into a brand new, state of the art facility. Royal Circuits acquired the facilitiy and completed a build-to-suit building improvement, which will allow a doubling of capacity as Royal Circuits expands its customer base and services for the next decade.
At a time where consolidation and closures are common in the PCB industry, Royal Circuits is one of the few companies that has expanded and built a brand-new facility, according to Scott Kohno, President of Royal Circuits’ Flex Division. “The exponential growth of the flex and rigid-flex market, together with our unique quick-turn ability gives Royal Circuits a very unique advantage in the marketplace” Kohno added. “We are able to produce rigid-flex circuits in less than 5-days and standard flex circuits in 3 days; and our customer from the Mil Aero and Medical are lined up for this delivery.”
About Royal Circuit Solutions
Royal Circuit Solutions is an expert at prototyping and developing new “first to market” products. It offers complete service from Application Engineering support to volume PCB manufacturing. The company also specializes in HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind vias, buried vias, micro-vias, vias in pad, copper filled micro-vias, resin filled vias, stacked vias, sequential build up and a full capability with high speed materials.
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RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
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IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.