-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Exhibits at electronica China 2019
March 20, 2019 | AT&SEstimated reading time: 1 minute
AT&S, one of the globally leading high-end connectivity solutions providers, exhibits at the Electronica China held from March 20-22, 2019 at the Shanghai New International Expo Center.
The company is showcasing its products and solutions supporting all of the mega trends in telecommunication, automotive electronics, wearables and medical electronics. Advancing miniaturization, high data rates and/or high frequencies, power electronics with increasing current densities and rising thermal problems, as well as optimized production processes are the challenges that modern applications face. AT&S presents solutions for extremely compact substrates/modules, advanced heat management, Embedded Component Packaging (ECP), HF printed circuit boards (PCBs) and flexible PCBs.
“Given the current mega trends such as 5G, IoT (internet of things), AI (artificial intelligence), Autonomous driving and Machine-to-Machine communication with higher data rates and high power densities, the demands on connection technology are continuously increasing,” said Erich Nuncic, CSO of mobile devices and substrates business unit at AT&S. “Our participation into the Electronica China has clearly demonstrated that AT&S has worked closely with its customers to deliver the necessary innovative solutions with leading edge technologies. A close cooperation already during the design and development phase and later on in mass production meet the needs of our world-class customers.”
As one of Austria’s largest investors in China, AT&S stands for high-tech and innovation in China since 2001. The company has the most advanced high-tech facility and process for mass production of high-end IC substrates and HDIs in both Shanghai and Chongqing. AT&S is fully committed to continuously investing in technology and innovation for semiconductors and microelectronics industry in China and contributing to the development of high-end and value-added manufacturing industry.
About AT&S
AT&S is the European market leader and one of the globally leading manufacturers of high-end printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments mobile devices, automotive, industrial and medical. As an international growth enterprise, AT&S has a global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul).
Suggested Items
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.