BTU International to Showcase Advanced Reflow Technologies at SMTconnect
April 8, 2019 | BTU International, Inc.Estimated reading time: 1 minute

BTU International, Inc. will exhibit at SMTconnect, scheduled to take place May 7-9, 2019 at the NurnbergMesse GmbH in Nuremberg, Germany. The company will showcase its new, award-winning Aqua Scrub flux management technology, and the Profile Guardian redundant monitoring system. The booth, in Hall 4, Stand 551, will feature a PYRAMAX 100A convection reflow oven.
Aqua Scrub Technology is BTU’s next-generation solder reflow flux management system. The patent-pending design uses an aqueous-based scrubber technology compatible with most known paste and flux types. The flux and solution are automatically contained and packaged for disposal. The Aqua Scrub is designed to decrease operational cost by 4X over traditional condensation systems
Profile Guardian pairs a thermocouple probe at product height with software to monitor temperature deviation from baseline – independent from control TCs. Monitor data is fully integrated with host communications (MES) from the oven. Additionally, it provides board level traceability when paired with bar code readers, which is a requirement for many large OEM/EMS customers.
The PYRAMAX 100A features 100" of heated length and eight zones, 350ºC maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. In addition, the PYRAMAX features BTU’s proprietary WINCON control system. WINCON features a simplified user interface and incredibly powerful analytical capabilities.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.