The Chemical Connection: Surface Finishes for PCBs
It’s Only Common Sense: 7 Tips to Focus on What Works
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
IPC SummerCom to Feature Panelpalooza
April 19, 2019 | IPCEstimated reading time: Less than a minute
The IPC SummerCom, to be held on June 15–20, in Raleigh, North Carolina, will feature Panelpalooza, a highly interactive panel platform that will cover challenges currently facing the electronics industry.
Topics covered during panels include BTC challenges, cleanliness measurements for process control, warpage-induced defects, microvia reliability, harmony between standards, and next-generation solder alloy developments.
For any questions about registering for the IPC standards development committee meetings, please contact your committee's staff liaison. Reach out to Brook Sandy-Smith, technical education program manager at BrookSandy@ipc.org, to share ideas for topics or volunteer to join as one of our esteemed panelists.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.