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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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IPC SummerCom to Feature Panelpalooza
April 19, 2019 | IPCEstimated reading time: Less than a minute
The IPC SummerCom, to be held on June 15–20, in Raleigh, North Carolina, will feature Panelpalooza, a highly interactive panel platform that will cover challenges currently facing the electronics industry.
Topics covered during panels include BTC challenges, cleanliness measurements for process control, warpage-induced defects, microvia reliability, harmony between standards, and next-generation solder alloy developments.
For any questions about registering for the IPC standards development committee meetings, please contact your committee's staff liaison. Reach out to Brook Sandy-Smith, technical education program manager at BrookSandy@ipc.org, to share ideas for topics or volunteer to join as one of our esteemed panelists.
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