Smart Pill Bottle Keeps Drugs Safe
May 7, 2019 | KAUSTEstimated reading time: 2 minutes
A smart pill bottle that sends wireless alerts when it detects tampering, overdose or unsafe storage conditions is just one of many potential health applications for new sensor technology being developed by a team at KAUST.
Digital technology offers opportunities to improve traditional approaches to issues threatening human health. For example, networks of tiny wearable sensors deployed in hospitals can be used to track influenza outbreaks in real time. But the high costs associated with electronic manufacturing means that these sensors aren’t available where they’re needed most—to the low-income populations that suffer disproportionately from epidemics.
Muhammed Hussain, doctoral student Sherjeel Khan and colleagues are working to make sensors more accessible using cheaper materials. For example, they recently demonstrated that it is feasible to create temperature and humidity sensors from paper by drawing circuits with conductive ink.
The team has now developed a stretchy sensor—an anisotropic conductive tape with a range of touch-sensitive applications. Assembled by sandwiching tiny silver particles between two layers of adhesive copper tape, the new material is nonconductive in its normal state. But when pressed by a finger, the double-layered tape makes an electrical connection that sends a signal to an external reader.
“Similar devices have been used in flat panel displays,” explains Khan, “but we’ve made them simple to build and easy to use by almost anyone.”
The researchers used their technology to create a smart pill bottle to help fight the problem of prescription drug abuse. After 3D-printing a lid that uses light-emitting diodes to count the number of pills dispensed, they taped paper-based humidity and temperature sensors to its underside. The bottle was then sealed with an outer layer of conductive tape that acts as a touch sensor.
If someone attempts to break into the bottle, or the insides become dangerously moist, a flexible control module inside the bottle analyzes the signals and delivers warnings to cell phones via a Bluetooth connection. The conductive tape could be used on its own or as part of a modular sensor system, and so Hussain envisions it could help groups looking for quick tests of innovative health sensors.
This sensor development that is easy to build also opens up broader possibilities for researchers. “If you give researchers a 'do it yourself opportunity,' there is a good chance they will use it to expand the horizon of electronics and empower humanity with better technology,” Hussain adds.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.