Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Ventec's QMS at German Facility Re-Certified under ISO 9001:2015
May 22, 2019 | Ventec InternationalEstimated reading time: 1 minute
Ventec International Group Co., Ltd. has again achieved ISO 9001:2015 certification for its Quality Management System at its German facility, following an audit by an external certifying authority.
ISO 9001:2015 sets out the criteria for a quality management system and is based on a number of quality management principles including a strong customer focus, the motivation and implication of top management, the process approach and continual improvement. Ventec's facility in Kirchheimbolanden, Germany first achieved ISO 9001:2015 certification in 2016, which, supplements the company's main manufacturing site certifications of AS9100 Rev D for aerospace and IATF 16949:2016 for automotive certifications, and offers customers the highest possible quality standards through a fully controlled global supply chain.
"I am very pleased to receive this re-certification only three years after the first certification—and without any instances of non-conformity," said Frank Lorentz, Internal General Manager. "It recognizes our entire team's hard work and the success of our quality strategy for the benefit of all our customers."
"Ventec maintains robust quality management systems in all its facilities around the world, ensuring that all our customers receive reliable, consistent, good quality products and services from us through our fully controlled global supply chain," said Mark Goodwin, COO Europe & Americas.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.