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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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FPCB Makers See Mini LED, COF as New Niche Application Segments
June 20, 2019 | DigitimesEstimated reading time: Less than a minute
Taiwan makers of flexible PCBs are gearing up to develop niche board products for mini LED and COF (chip on film) applications, which are expected to become their new growth drivers next to handsets, IoT devices and antennas, Digitimes reported.
Among the makers, Zhen Ding Technology (ZDT) has successfully developed COF substrates and is expected to complete product validations at clients and start small-volume shipments by the end of 2019.
Another major FPCB maker, Flexium Interconnect, is moving to develop mini LED control modules, and upstream material supplier Taiflex Scientific also chooses to venture into the mini LED market with cover layers needed for mini LED substrates.
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