TactoTek and Lightworks Gmbh Partner for Lighting Innovation for Vehicles
March 27, 2020 | TactoTekEstimated reading time: 1 minute
TactoTek, the Finland-based company that develops, industrializes and licenses in-mold structural electronics (IMSE™), and Lightworks GmbH, a leading automotive lighting design and engineering consultancy, announced their collaboration on in-mold lighting solutions. Together the companies will accelerate the development and use of in-mold lighting for styling and function for vehicle interiors and exteriors.
“Lighting is a prominent feature in over 95% of our customers’ IMSE solutions. From styling to status indicators and dynamic operator alerts, we’re seeing incredible design creativity and high value solutions for users. Lightworks combines a deep understanding of their customers’ preferred styling, aesthetics and design language, with the illumination design and optical engineering expertise to create lighting solutions that complement that vision,” noted Dave Rice, SVP Marketing and Business Development at TactoTek.
In TactoTek IMSE solutions LEDs and the circuitry that drives them are molded inside of the plastic that is the structure of the part. The result is very thin, seamless components that can conform to complex shapes and are efficiently mass produced.
Michael Höfgen, founder and CEO of Lightworks stated, “Light as part of automotive user experience is more important for styling and function than ever before. The huge benefit of IMSE is the technology’s fusion of dynamic lighting with highly decorative surfaces and HMI functionality in 3D structures as thin as 2mm. We can enhance many of our illumination package designs with IMSE elements.”
TactoTek is building a partner program with industrial design and engineering companies serving automotive, smart home/IoT, appliance and other markets so design experts can enhance their solutions with IMSE technology.
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.