-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
American Standard Circuits Now Offers Copper Filled Blind Vias
October 12, 2020 | American Standard CircuitsEstimated reading time: 1 minute

With the use of Uyemura’s Thru-Cup EVF-R plating chemistry, ASC has added acid copper plating filled blind vias to their product capabilities. Copper filled vias lend themselves to stacked via technology, achieved using laser formed or mechanically drilled vias. Traditionally a staple in consumer products, ASC is seeing increased demand in this technology for high reliability applications. The ability to fill between 0.0039-0.010” vias at aspect ratios up to 1:1 greatly expands ASC’s capabilities in that market space and further meeting the reliability demands.
American Standard Circuits’ President and CEO Anaya Vardya stated, “We have been producing boards with epoxy filled vias for many years now and that has become pretty standard technology. In the past 24 months we have seen an increasing demand for copper filled vias, so much so that we knew we needed to provide this technology as well. Adding copper filled blind vias puts us in a great position to meet even more customer needs as the demand increases.”
About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question go to www.asc-i.com.
Visit I-007eBooks to download your copies of American Standard Circuits’ micro eBooks today:
The Printed Circuit Board Designer’s Guide… to Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
The Printed Circuit Designer’s Guide to Thermal Management: A Fabricator’s Perspective
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.