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Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
December 21, 2020 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute

Chapter 2: IMPCBs or MCPCBs
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.
This chapter will focus on the IMPCB design considerations, and Chapter 4 will focus on RF thermal management. We will focus on things designers should be discussing with their PCB supplier to ensure manufacturability and a successful product launch. Since the choices, options, and decisions can be extremely complicated, it is critical to engage early and collaborate with the PCB fabricator about the specific design to ensure the most cost-effective solution.
Some of the more common applications of IMPCBs include:
- Power Conversion: Thermal-clad offers a variety of thermal performances, is compatible with mechanical fasteners, and is highly reliable
- LEDs: Using thermal-clad PCBs ensures the lowest possible operating temperatures and maximum brightness, color, and life
- Photovoltaic Energy: Renewable energy to power telecommunications, military camps, residential and commercial structures, and battery charging stations
- Motor Drives: Thermal-clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements
- Solid-State Relays: Thermal-clad offers a very thermally efficient and mechanically robust substrate
- Automotive: The automotive industry uses thermal-clad boards, as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization
To download The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, click here. You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.
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Brent Fischthal - Koh YoungSuggested Items
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.
ASC Sunstone Circuits to Exhibit at AEMS 2025
09/09/2025 | American Standard CircuitsASC Sunstone Circuits will be exhibiting at AEMS 2025 (Anaheim Electronics and Manufacturing Show) to be held at the Anaheim Convention Center on September 24 and 25, 2025.
Automation Meets Sustainability
09/08/2025 | Rick Nichols, GreenSource EngineeringGreenSource Engineering (GSE) is proud to have contributed to the first successful reshoring of a PCB facility on a greenfield site in the United States. While we are honored to have played a key role, full credit for this achievement goes to SEL for its vision, commitment, and professionalism.
Cadence to Acquire Hexagon’s Design & Engineering Business
09/08/2025 | Cadence Design SystemsCadence announced it has entered into a definitive agreement to acquire the Design & Engineering (D&E) business of Hexagon AB, which includes its MSC Software business—a pioneer in engineering simulation and analysis solutions.
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.