-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
December 21, 2020 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute

Chapter 2: IMPCBs or MCPCBs
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.
This chapter will focus on the IMPCB design considerations, and Chapter 4 will focus on RF thermal management. We will focus on things designers should be discussing with their PCB supplier to ensure manufacturability and a successful product launch. Since the choices, options, and decisions can be extremely complicated, it is critical to engage early and collaborate with the PCB fabricator about the specific design to ensure the most cost-effective solution.
Some of the more common applications of IMPCBs include:
- Power Conversion: Thermal-clad offers a variety of thermal performances, is compatible with mechanical fasteners, and is highly reliable
- LEDs: Using thermal-clad PCBs ensures the lowest possible operating temperatures and maximum brightness, color, and life
- Photovoltaic Energy: Renewable energy to power telecommunications, military camps, residential and commercial structures, and battery charging stations
- Motor Drives: Thermal-clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements
- Solid-State Relays: Thermal-clad offers a very thermally efficient and mechanically robust substrate
- Automotive: The automotive industry uses thermal-clad boards, as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization
To download The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, click here. You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.
Suggested Items
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
New Companion Guide to ‘DFM Essentials’ Delivers Deeper, Practical PCB Design Insights
06/05/2025 | I-Connect007The Companion Guide to DFM Essentials: Tips for Designing for Manufacturing is now available for free download. Building on the popular Printed Circuit Designer’s Guide to... DFM Essentials, this new resource from American Standard Circuits and ASC Sunstone Circuits offers advanced, real-world guidance to help PCB designers streamline production and avoid costly pitfalls.
Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.
Orbel Corporation Integrates Schmoll Direct Imaging
06/04/2025 | Schmoll AmericaOrbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.