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Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers

04/11/2025 | Avnet
Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.

New Guide Offers In-Depth Look at Thermal Management in PCB Design

04/14/2025 | I-Connect007
I-Connect007 is proud to release The Companion Guide to PCB Thermal Management, a must-have resource designed to complement NCAB’s popular podcast series. Created for engineers and PCB designers, this guide offers a comprehensive look at critical thermal management strategies essential for today's high-performance electronics.

DigiKey Announces Sponsorship of KiCad to Support Open-Source EDA Development

03/26/2025 | DigiKey
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is proud to announce its continued sponsorship of KiCad, the leading open-source Electronic Design Automation (EDA) suite, reinforcing a shared commitment to advancing open-source tools for the electrical engineering community.

Networking and Growth: Highlights from the IPC Emerging Engineer Reception

03/19/2025 | Marcy LaRont, I-Connect007
It was my first day in Anaheim for IPC APEX EXPO, and I arrived at John Wayne airport on Saturday to cool and sunny weather, which, coming from Arizona, is my favorite. The show starts with technical and standards work over the weekend as we prep for the show floor opening in the days to come. Exhibitors and union workers get busy building the impressive booths that make up the exhibition, which started on Tuesday and saw a steady flow of attendees all day long.

TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications

03/12/2025 | PRNewswire
Texas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
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