Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Global Citizenship: The Global Push for Digital Inclusion

07/16/2025 | Tom Yang -- Column: Global Citizenship
It can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. As a global community, we must ensure that technology is available to all. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives.

HCLTech, Equinor Expand Digital Collaboration

07/02/2025 | BUSINESS WIRE
HCLTech, a global technology leader, and Equinor, Europe's largest energy supplier and a pioneer in renewables and low-carbon solutions, have expanded their IT collaboration to support the next phase of Equinor’s digital transformation.

Microchip Enhances Digital Signal Controller Lineup with Industry-Leading PWM Resolution and ADC Speed

06/21/2025 | Microchip
Evolving security and functional safety demands, coupled with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance with industry standards.

UNIST Signs Strategic Partnership with Microsoft Korea to Accelerate AI-Driven Digital Transformation

06/16/2025 | UNIST
UNIST signed a strategic partnership agreement with Microsoft Korea at the university’s Main Administration Building. The partnership aims to actively incorporate AI technologies into practical applications and to advance university-specific digital transformation initiatives.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in