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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 10, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Right now, it seems that almost everyone I know is talking about the future. Doesn’t matter whether it’s with my family, loved ones, friends, industry colleagues, or neighbors I meet on the street, conversations are almost entirely forward-looking. This being the holiday season, some reminiscing is to be expected, but I’m just not hearing it in the chatter all around me–this year is different somehow. And it shows in this edition of my must-reads for the week as well.
This week we bring you forward-looking discussions with Dr. John Mitchell, IPC president and CEO, on IPC APEX EXPO and what to expect in the future; and an interview with Isola’s CEO, Travis Kelly, introducing a new industry consortium, the Printed Circuit Board Association of America. Innovative additive technologies gain the spotlight as well, with Nano Dimension and a combination of Averatek and American Standard Circuits leading this week’s news cycle. Wrapping up the theme is Siemens’ position as a visionary in the Industrial IoT Magic Quadrant, as compiled by Gartner.
The Mission of the New Printed Circuit Board Association of America
Published December 9
Barry Matties recently met with Travis Kelly to discuss the formation of the Printed Circuit Board Association of America (PCBAA), a consortium of U.S.-based companies he chairs to support U.S. domestic production of PCBs. PCBAA was established on three pillars, and Travis explains how they intertwine with each other—and with other similar organizations in the industry. This is an important read no matter what sector of the industry you fall in.
John Mitchell: Focus on the Future
Published December 6
In a far-ranging interview, first published in I-Connect007’s December issue of SMT007 Magazine, Dr. John Mitchell and Barry Matties discuss the upcoming IPC APEX EXPO, IPC programs, and the challenges–and opportunities–facing our industry. If you think Dr. Mitchell's assessment would be pessimistic, you'd be wrong.
Nano Dimension Sells Two DragonFly IV 3D-AME Systems to Defense and Government Agencies
Published December 6
Nano Dimension announced that it has sold the first two DragonFly IV 3D-AME printers, in addition to the two machines that have completed beta sites processes with other leading customers. DragonFly IV is an additive manufacturing system for fabrication of electronic devices which deposits materials while concurrently integrating capacitors, antennas, coils, transformers, and electro-mechanical components.
Siemens Positioned in Visionaries Quadrant of Gartner Magic Quadrant for Industrial IoT Platforms
Published December 7
Siemens Digital Industries Software announced it has been positioned by Gartner in the Visionaries Quadrant of the Gartner Magic Quadrant for Industrial IoT platforms. Siemens is positioned as the sole vendor in the “Visionaries” Quadrant in the report on its first participation in the research. Gartner describes Visionaries in a market as the innovators that drive the market forward by responding to emerging, leading-edge customer demands and by offering new opportunities to excel.
American Standard Circuits Utilizes Averatek Process for Medical Technology
Published December 6
CEO Anaya Vardya discusses the addition of the Averatek A-SAP™ to ASC’s offerings. In the news item, Vardya explains, “Our medical electronics customers depend on us to provide them with the most reliable PCBs possible. When dealing with medical products it is not hyperbole to say that it is always a matter of life or death. With the A-SAP manufacturing process ASC can now provide our customers with ultra high-density technology, 25 micron trace and space, and improved reliability, reducing layer counts and micro via lamination cycles, ultimately simplifying the design.”
Suggested Items
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
Northrop Grumman to Deliver US Navy’s E-130J Nuclear Command, Control and Communications Aircraft
12/23/2024 | Northrop GrummanNorthrop Grumman Corporation has been selected as the prime contractor to deliver nuclear command, control and communications (NC3) aircraft for the U.S. Navy’s Take Charge And Move Out (TACAMO) mission.
BIG, Delta Pioneer the First Low-Carbon Nitrogen in Thailand's Electronics Industry
12/23/2024 | Delta ElectronicsBIG, a climate technology company, and Delta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions today announced a strategic partnership with BIG to advance the decarbonization of Thailand's electronics industry.
GlobalFoundries Sets New Bar as Largest Semiconductor Company to Protect Innovation by Joining LOT Network
12/19/2024 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) and LOT Network announced that GF has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.