SEMICON Taiwan 2021 to Feature Over 650 Exhibitors
December 27, 2021 | SEMIEstimated reading time: 3 minutes
The latest advances in compound semiconductors, heterogeneous integration, smart manufacturing and green manufacturing will take center stage December 28-30 at SEMICON Taiwan 2021 as industry leaders and visionaries gather at the Nangang Exhibition Center, Hall I (TaiNEX 1) for the latest innovations and trends driving microelectronics industry growth. Registration is open for the region’s premier event for the electronics manufacturing supply chain in Taiwan.
SEMICON Taiwan logoSEMICON Taiwan 2021 will feature more than 650 exhibitors at nearly 2,150 booths. Semiconductor industry giants including TSMC, Etron Technology, ASE, SPIL, WIN Semiconductors, Nanya Technology, PSMC , Unimicron, TEL, Applied Materials, ASM, Lintec, Hermes Epitek and DuPont and other leaders across the semiconductor supply chain will demonstrate innovations powered by cutting-edge technologies including artificial intelligence (AI), Internet of Things (IoT) and 5G.
“The global semiconductor market is projected to grow more than 20% with Taiwan's integrated circuit (IC) production expected to top NT$4 trillion in 2021,” said Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan. “To help fuel that growth, SEMICON Taiwan 2021 will feature business matching and other opportunities for the industry to drive innovations across advanced semiconductor manufacturing, advanced testing and strategic materials, and enhance its sustainability and environmental, social and governance (ESG) efforts while addressing other areas key to the ongoing industry expansion.”
Themed Exhibitions at SEMICON Taiwan 2021
Themed Forward as One, SEMICON Taiwan 2021 will feature the following four themed exhibitions while promoting Taiwan’s semiconductor industry development policies. New pavilions focusing on investment in Central Taiwan Science Park (Taichung) and Southern Taiwan Science Park (Tainan and Kaohsiung) will also highlight the event.
Compound Semiconductor Innovation Zone – Leading companies such as WIN Semiconductors, IQE, Applied Materials and Hermes Epitek will highlight end-user applications of 5G, 3D sensing, lidar and radar, and powertrain. At SEMI Talks, experts from GaN Systems, UMC, Episil and National Taiwan University will explore Taiwan's competitive advantages in wide-bandgap (WBG) semiconductors. More than 10 leading companies will offer a deep dive into trends and breakthroughs enabled by compound semiconductor materials such as gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC).
Heterogeneous Integration Innovation Zone – With the rise of 5G, AI and other leading-edge technologies increasing requirements for packaging and transistors extending beyond size limits, game-changing heterogeneous packaging technologies have emerged to fuel semiconductor advances to extend Moore’s law. ASE, SPIL and other leading players will showcase high-performance computing (HPC) technology, along with IC design, manufacturing, packaging and terminal system applications. Chiplets, 3D stacking, and substrate design will come into sharp focus.
Smart Manufacturing Journey – Staged by ADLINK, AWS Taiwan, Beckhoff, FET, Siemens, and TM Robot, this hands-on interactive experience of the latest smart manufacturing solutions through virtual reality (VR) will showcase drone, AR smart glasses, and IoT applications. The exhibition will also promote the adoption of HPC in semiconductor manufacturing sites to improve yield and production capacity and facilitate digital transformation. In addition, its Cybersecurity Pavilion will address critical topics including hacker attacks; viruses; and cybersecurity drills, maturity evaluation and industry standards with the aim to enhance cybersecurity across the supply chain.
Green Manufacturing Innovation Zone (New) – Demonstrating Taiwan’s commitment to sustainable development, this zone will gather technology giants such as TSMC, ASE, Nanya Technology, and PSMC to highlight innovative green manufacturing technologies and front-end applications. Success stories on green design, energy management, resource regeneration, and supply chain resilience will also be featured. In collaboration with the Taiwan semiconductor community, SEMI will launch its Semiconductor Industry ESG Sustainability Initiative, aimed at strengthening the industry’s sustainability strategies and demonstrating Taiwan’s commitment to sustainable manufacturing.
Workforce Development Pavilion
SEMICON Taiwan 2021 will connect young talent with career opportunities as industry leaders including TSMC, Applied Materials, ASE, ASML, DuPont, Entegris, Lam Research, Merck, Micron and TEL discuss talent development trends and career planning insights. The Workforce Development Pavilion will feature one-on-one talent matching and discussions on key topics including diversity and inclusion, women in technology and creating winning talent strategies.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.