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BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing

06/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.

atg Luther Maelzer Announces Grand Opening of New Office and Manufacturing Facility

06/02/2025 | atg Luther & Maelzer GmbH
Atg Luther Maelzer, a leading supplier of electrical testing solutions for the PCB industry, recently celebrated with a grand opening of their new office and manufacturing facility in Wertheim, Germany.

Standards: The Roadmap for Your Ideal Data Package

05/29/2025 | Andy Shaughnessy, Design007 Magazine
In this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.

High-frequency EMC Noise in DC Circuits

05/29/2025 | Karen Burnham, EMC United
EMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
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