Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Denton Vacuum Announces New Order from Leading OLED Display Manufacturer
April 25, 2022 | PRNewswireEstimated reading time: 1 minute
Denton Vacuum LLC announced it has won a new system order for encapsulation from a leading North American OLED display manufacturer. The system is based on Denton's production level Discovery sputtering platform utilizing Denton's patented Inverted Cylindrical Magnetron (ICM) architecture. The system provides dense, optically clear films with unparalleled uniformity on 200mm wafers.
Dr. David Douglass, Senior Product Manager at Denton Vacuum, comments, "our ICM technology provides unique capabilities for both flat film and 3 dimensional coatings. For OLED encapsulation, we can deposit films with excellent optical quality that minimizes light loss while being dense enough to provide an oxygen barrier."
He adds, "For flat films, we can achieve less than 0.5% non-uniformity over a 200mm wafers. This uniformity is inherent in the architecture and requires no masking or beam shaping, and it enables multiple applications including precision optical filters and ultra-high uniformity seed layers. We can also achieve similar uniformity on curved optics."
Denton's unique patented PVD and CVD technologies enable it to provide display manufacturers with solutions to their most challenging manufacturing requirements. Frank Cumbo, President and CEO of Denton Vacuum, explained, "We are engaged in technology demonstration programs with several tier one companies. We're adding expanded demo capabilities for both ICM sputtering applications and Plasma Ion Beam based CVD using our patented, new-to-the-world linear plasma ion beam technology. This enables us to enter new markets such as glass and plastic displays, wear-resistant coatings, and automotive glass."
These sources and technologies are suitable for high volume production and are compatible with Denton's Versa cluster tool platform for wafer-based applications. Their lengths are scalable to over a meter in the Phoenix linear transport platform for large area substrate manufacturing. For pilot production and industrial R&D, Denton Vacuum offers a versatile drum style batch system and single substrate modules.
Share on:
Suggested Items
WiSA Technologies Inks Definitive Agreement to Acquire CompuSystems
12/27/2024 | BUSINESS WIREWiSA Technologies, Inc., which anticipates closing its acquisition of Datavault® intellectual property and information technology assets of privately held Data Vault Holdings Inc.® and changing its name to Datavault Inc.
Foxconn Partners with Porotech to Enter the AR Glasses Market
12/27/2024 | FoxconnHon Hai Technology Group (Foxconn) announced a strategic partnership with Porotech to enter the augmented reality (AR) glasses market. This collaboration leverages Porotech's cutting-edge gallium nitride (GaN) microLED technology with Foxconn's vertically integrated manufacturing capabilities, from wafer processing to packaging and optical modules.
Green Tech Accelerator: Tackling Water Resource Challenges and Unlocking Renewable Energy Opportunities
12/26/2024 | BUSINESS WIREGreen Tech Accelerator collaborates with startups, offering courses, mentorship, and international market strategies to implement and validate carbon reduction solutions. This Taiwanese initiative empowers SMEs to progress toward net-zero emissions.
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.