BAE Systems to Deliver Advanced Ballistic Missile Seekers
August 17, 2022 | Business WireEstimated reading time: Less than a minute
BAE Systems has received a contract from Lockheed Martin to design and manufacture next-generation infrared seeker technology for the Terminal High Altitude Area Defense (THAAD) interceptor missile. The THAAD seeker provides critical sensing and guidance capabilities that help protect the U.S. and global allies from ballistic missiles.
“THAAD is a highly effective system for mitigating high-speed missile threats and we’re making it more capable,” said Greg Procopio, director of Precision Guidance and Sensing Solutions at BAE Systems. “We’re anticipating the capabilities of tomorrow’s ballistic missiles and designing adaptable electronic systems to counter those threats.”
Guided by BAE Systems’ infrared technology, THAAD interceptors engage ballistic missiles and destroy warheads with kinetic force in or out of the atmosphere. The seeker design is informed by BAE Systems’ expertise in precision munitions, electronic warfare systems, and small form factor electronics, as well as its extensive knowledge of the threat environment.
BAE Systems’ work on the THAAD seeker takes place at the company’s Electronic Systems facilities in Endicott, New York; Huntsville, Alabama; and Nashua, New Hampshire.
Suggested Items
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.