Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
BAE Systems to Deliver Advanced Ballistic Missile Seekers
August 17, 2022 | Business WireEstimated reading time: Less than a minute
BAE Systems has received a contract from Lockheed Martin to design and manufacture next-generation infrared seeker technology for the Terminal High Altitude Area Defense (THAAD) interceptor missile. The THAAD seeker provides critical sensing and guidance capabilities that help protect the U.S. and global allies from ballistic missiles.
“THAAD is a highly effective system for mitigating high-speed missile threats and we’re making it more capable,” said Greg Procopio, director of Precision Guidance and Sensing Solutions at BAE Systems. “We’re anticipating the capabilities of tomorrow’s ballistic missiles and designing adaptable electronic systems to counter those threats.”
Guided by BAE Systems’ infrared technology, THAAD interceptors engage ballistic missiles and destroy warheads with kinetic force in or out of the atmosphere. The seeker design is informed by BAE Systems’ expertise in precision munitions, electronic warfare systems, and small form factor electronics, as well as its extensive knowledge of the threat environment.
BAE Systems’ work on the THAAD seeker takes place at the company’s Electronic Systems facilities in Endicott, New York; Huntsville, Alabama; and Nashua, New Hampshire.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.