American Made Advocacy: Taking the Fight to Capitol Hill
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We have quite a mix in this week’s must-reads. The November issue of Design007 Magazine was published, and you don’t want to miss Andy Shaughnessy’s column. This week, we also have a discussion of long-flex PCBs with CEE PCB’s Jerome Larez, and we revisit my forward-looking interview with Dr. Evelyne Parmentier of Dyconex. Jim Will gives us an update on the many things that have transpired in his first five months as executive director at USPAE. Finally, Happy Holden’s next installment of Happy’s Tech Talk looks into the weaknesses of CAD drawings by using a famous Escher print as an example. Happy is definitely one of a kind.
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1
Last month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.
An Update on USPAE's Strategic Initiatives
James Will became executive director of the U.S. Partnership for Assured Electronics (USPAE) in May and now provides this update on the group's strategic initiatives. The organization, which is affiliated with IPC, recently transitioned to being a 501(c)(3). It is navigating through a dynamic landscape, working to enhance our microelectronics manufacturing capabilities including PCBs, and adapt to emerging technology trends and market challenges.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.
Navigating the Supply Chain Challenges and Opportunities in Aerospace and Defense
The intersection of supply chain management and sustainability is evolving rapidly, driven by a mix of voluntary and mandatory actions from stakeholders including investors, governments (federal, state, and international), customers, suppliers, and communities. Beyond the traditional considerations of price, quality, and delivery, companies face increasing pressure to address challenges associated with environmental, social, and governance (ESG) impacts.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week in PCB design, fabrication, and assembly. We published some mixed news about the EMS segment, and an article about the supply chain. Are companies holding onto too much inventory? After the recent supply chain snafus, I can certainly understand why they might. We have an article about liquid metal ink, a cool new technology developed by LDQX, formerly known as Averatek. We also have an article about fighting advanced counterfeiting methods, and news about an acquisition by Siemens.
Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise
In this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect. Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Just this month, the Fall issue of IPC Community was released, spotlighting the global activities of IPC and its members. SMT007 Magazine covers the scary situation around counterfeit components. Design007 Magazine is not playing tricks with its hard-hitting discussions about “partial HDI.” (If you are asking yourself what that is, you really need to take a look.) Finally, PCB007 Magazine’s alternate metallization issue offers some real treats, including an interview featured this past week with Carmichael Gugliotti of MacDermid Alpha. In you’re in the U.S., here’s to an early Happy Halloween.
Counterfeit Concerns: Navigating the Risks
Nolan Johnson meets with Diganta Das, PhD, and Michael Azarian, PhD, research scientists at the CALCE Electronic Products and Systems Center at the University of Maryland, to discuss the increasing issue of counterfeiting in the electronics and assembly industry. Diganta and Michael highlight the need for robust detection methods and standards to mitigate risks, specifically referencing SAE AS6171 for inspection and AS5553 for counterfeit mitigation. They cover real-world cases, like counterfeit network equipment scandals to relatively simple issues of consumer electronics accessories to illustrate the complexity of the issue and debate the philosophical implications of labeling products that contain a few minor counterfeit components as “counterfeit.”
Build Better 2024 Summit: Creating a Vision for Future Tech
Most likely, there aren’t many manufacturing summits that take place on an aircraft carrier, so it was pretty impressive to be on the USS Hornet, with a beautiful view of the San Francisco harbor at Build Better 2024 on Wednesday, October 16, 2024. Billed as “the only manufacturing summit for engineering and operations leaders developing electronics”, the event was quite interesting.
Fall 2024 Issue of IPC Community Now Available
There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
The SD11 Inkjet Printer and Ventec Giga Solutions
Ventec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.
Battling Counterfeit Electronics in Manufacturing
Paul Jarski, product development manufacturing leader at Case New Holland (CNH), discusses his extensive experience with counterfeit electronics throughout his career. He highlights the challenges faced during market allocations, where counterfeit parts infiltrated supply chains and causing significant issues. Paul recounts the rigorous processes implemented to detect and prevent counterfeits, including advanced material analysis and testing. Counterfeit parts occasionally slipped through despite these measures, leading to costly and time-consuming audits and verifications to ensure product integrity and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Fall presents us with a lot of tradeshow activity, such as the Anaheim Electronics & Manufacturing Show, which kicked off the month in California. Our intrepid managing editor Andy Shaughnessy has been on the scene and I look forward to hearing more about the show from him. Next week, we’ll be at PCB West in the Bay Area, followed by SMTAI in Chicago the following week. For me, it feels like a proper launch into standard Q4 craziness highlighted by the end-of-year sales hustle and frenetic finalization of 2025 budgets. October also brings a stark reminder that the holiday season will soon be upon us. So, let the crazy begin.
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
If you know Dave Hoover of TTM, then I am honored to inform you that he has retired from the industry as of this week. But we can keep tabs on him through his weekly online blues radio program “Groovy Hoovy’s Different Shades of Blue Radio and Video Show.” Congratulations on your transition to “civilian” life, Dave.
Tech Trajectories: Projecting Trend Advancements
Reflecting on technological advancements and examining how foundational technology trends evolve is essential to seeing where the world and society are headed. Last year, significant strides were made in data governance, automation, edge computing, artificial intelligence (AI), and the metaverse. IEEE Standards Association (IEEE SA) is keeping its eye on what’s ahead for these technologies that are transforming various industry sectors. In this article, I’ll examine the current state of these technologies and outline the advancements and directions we expect ahead.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”
IPC Releases Newest List of Standards Updates, Revisions
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q3 2024.
From Silicon to Systems
For the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.
Audits: A Critical Element of Process Control
A formal audit always seems difficult to justify. Companies do not want the expense, and employees do not want the hassle. There is always a chance of failure, and management struggles to understand the benefits. If you or your company has had issues with auditing, hopefully, this article will help you feel a little more comfortable about the auditing process.
In Honor of the U.S. Labor Day
Sept. 2, is Labor Day in the United States, always observed the first Monday in September. In its official declaration, we learn that “Labor Day is an annual celebration of the social and economic achievements of American workers. The holiday is rooted in the late 19th century when labor activists pushed for a federal holiday to recognize the many contributions workers have made to America’s strength, prosperity, and well-being.”
Asymmetric Hybrid Printed Circuit Board Design: Warpage Considerations
The printed circuit board (PCB) accounts for a significant portion of the PCBA’s (printed circuit board assembly) BOM (bill of material) cost. Designs with hybrid PCB stackup are adopted to reduce the cost of the PCB by using less expensive laminate materials in layers that do not have routings for high-speed signals (e.g., power and ground layers). The conventional hybrid PCB stackup design is symmetrical in the middle. This engineering technique has been employed in the data center industry for quite some time. To extend the idea and optimize the purpose of hybrid PCB stackup design, the feasibility of an asymmetric hybrid stackup is currently being studied.
Give Yourself an Edge at the IPC High Reliability Forum 2024
For those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.
A Less Expensive Defense and Aerospace PCB Fab Startup
Editor’s note: Investing in a new printed circuit board fabrication startup is not for the faint of heart or the light of wallet. Standing up a new “high-tech” PCB fab facility capable of becoming qualified for aerospace and defense work typically takes a minimum investment of $50 million. However, Alex Stepinski says entering the defense and aerospace markets with a new PCB fabrication start-up facility far under this prohibitive cost benchmark is possible when good partnerships, innovation, and sound engineering design enter from the beginning. In this article, Alex Stepinski outlines just how this can be achieved.
UHDI Fundamentals: UHDI Applications for Aerospace
Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
BPMI Inc. Uses IPC Standards to Support the U.S. Nuclear-powered Naval Fleet
Our IPC member profile focuses on Bechtel Plant Machinery Inc (BPMI), responsible for the fabrication, test, delivery, installation, and field support of high-quality nuclear power plant components for installation in submarines and aircraft carriers.
UHDI Fundamentals: UHDI for RF Microwave Applications
Ultra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:
Counterfeit Detection Course: It’s the Real Deal
Anthony (Tony) Bryant is a trained expert in component counterfeiting techniques who has been collaborating with IPC on a new intermediate-level course on counterfeits. Tony is in final preparation to launch this course and shared his reasons for the course, as well as information about its content and value to EMS companies.
The Value Side of Training, Part 1: Five Easy Ways to Measure the ROI on Training
The best thing about a good investment is the yield it provides. This series of articles on the value side of training will focus on how to effectively measure the return on your investment (ROI) when training your staff. I will offer practical, quantifiable metrics you can apply today. Think of it as a quick checklist for every effective training program.
Pushing the Limits of PCB Impedance Control
All PCB fabricators have their own carefully guarded methods of modifying their process to achieve the desired controlled impedance specification. When you start considering the techniques and processes in PCB manufacturing, the list seems endless: etching, high layer counts, feature density, pressing, layer registration, material storage, and expansion/contraction. With so many contributing factors, who can blame them for playing their cards close to the vest?
Shane Whiteside Appointed as New PCBAA Chair
Summit Interconnect President and CEO Shane Whiteside was recently appointed as chair of the Printed Circuit Board Association of America (PCBAA), replacing Travis Kelly, CEO of Isola Group. Shane’s distinguished career in PCB manufacturing and leadership spans several decades, so this new role lends itself well to PCBAA’s mission as an important advocacy vehicle for the PCB industry.
Beyond Prepreg: The Glassless ‘Revolution’
As our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
USPAE’s Jim Will on PCBMC, Defense Needs, and Onshoring
Jim Will has assumed the role of executive director of the U.S. Partnership for Assured Electronics (USPAE). In his first interview with I-Connect007, Jim discusses his background in the commercial and defense industries, emphasizing U.S. defense assured electronics needs. His passion shows through as he discusses USPAE initiatives and looks forward to finding ways for partner organizations to work more closely together.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
He’s back, and in splendid form. Pete’s Starkey’s coverage of the EIPC Summer Conference, which took place June 4-5 at the European Space Centre, The Netherlands, is top notch. Joan Tourné from NextGIn Technologies emphasized that our attention must be focused on the interconnection ability of our PCBs and highlights VeCS as an alternative to the traditional plated-through-hole approach. Finally, Martyn Cauwe of IMEC discusses environmental impact and specifically, the need for a better, parametric approach to quantifying it, something European businesses are being required to do on the regular.
IPC Impact Day Recap With Rich Cappetto
IPC has hosted its annual IPC Impact Day in Washington, D.C., for at least the past decade, with the first event taking place in the 1990s. This popular and important advocacy tool allows an industry segment to meet their local congresspeople, educate them on important issues, and influence new or existing legislation to support their interests. We spoke with Rich Cappetto, senior director of North American government relations at IPC, about the importance of the event and what it means for the greater PCB industry. He also highlighted an important change: There will be several IPC Impact Days throughout the year to allow smaller groups of industry professionals to visit Washington more often with a more targeted message.
Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1
Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles.
An IPC ‘Blockbuster’: IPC-7711/21
Dan Foster, Missile Defense Agency, has been instrumental in developing IPC-7711/21, Rework, Modification and Repair of Electronics Assemblies, over several revisions of this important guideline document. We talked to Dan and committee member Agnieszka Ozarowski, BAE Systems, about the most recent revision.
Governments Struggling With ‘Silicon-to-Systems Approach’
What do you do when you don’t know what to do? That is the conundrum facing U.S. government officials overseeing billions of dollars in strategic investments in the domestic microelectronics industry. Enormous grants are beginning to flow to the chips sector, and after years of IPC advocacy and education efforts, policymakers have gained a clearer picture of the rest of the electronics supply chain, including everything chips depend on to function.
Advancing PCB Technology: A Conversation With John Johnson
John Johnson, an industry veteran with 45 years of experience, shares insights on the adoption of the Averatek process at American Standard Circuits, highlights the shift toward finer lines and spaces in PCB manufacturing, and emphasizes the importance of technology, cleanliness, and material adhesion in achieving ultra-fine lines. He addresses the challenges in advancements of the additive process, emphasizing the need for a mindset shift and employee training.
The Sky's the Limit: A Day in the Life of PCB Designer Paul Brionez
Paul Brionez is a senior printed circuit board layout engineer for Wisk Aero LLC. He’s responsible for the layout of PCBs and the management of library parts being created to use in PCB assemblies. He’s also involved in the creation of processes and procedures to be used in the creation, management, and release/revision of PCBs and PCBAs used for Wisk Aero applications.
Chiplet Architecture for AI Will Create New Demands for Assembly
As we look deeper into the entire AI ecosystem, it becomes clear that AI algorithms are intensely hungry for compute power. This demand for compute resources is accelerating beyond the customary rate predicted by Moore’s Law, just as traditional semiconductor fabrication methods are failing to maintain Moore’s Law. It’s a real dilemma.
Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.
Advocacy: There’s No Time to Waste
In the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.
Real Time with… IPC APEX EXPO 2024: Summit Interconnect: Ready for Challenges of Today and Tomorrow
Guest Editor Gabriel Zepeda and John Vaughan, VP of strategic markets for Summit Interconnect, highlight the challenges in the PCB sector, such as the dwindling number of fabricators and the trend towards miniaturization. As John points out, Summit was a founding member of the Printed Circuit Board Association of America, which has grown to 50 member and aims to educate legislators, while funding opportunities support chip operations.
Listen Up: Popular Podcast Series Returns With Discussion of Electroless Copper
In the latest episode of the podcast series, On the Line With: Designing for Reality, Nolan Johnson returns to Sunstone Circuits in Mulino, OR, to continue down the manufacturing process with Matt Stevenson.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
USPAE to Springboard U.S. Technology Forward
The U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Real Time with… IPC APEX EXPO 2024: Insight into Summit Interconnect's Success
Shane Whiteside, CEO of Summit Interconnect, discusses the company's recent recognition as one of the best PCB fabricators in the industry by receiving IPC's Peter Sarmanian award. Whiteside touches on the impact of changes in the marketplace, such as the Defense Production Act and presidential determination, on their growth. Whiteside also shares the company's focus on mechanical and data automation to enhance manufacturing processes and anticipates more automation and evolution in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
One year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Growth Potential: Electronics Manufacturing Driving Massive Surge in Manufacturing Investment
In the early months of the pandemic, investment in manufacturing infrastructure, such as plants and production facilities, declined sharply. Real investment dropped over 11%, before finally recovering to pre-pandemic levels in the first half of 2022. Over the past two years, however, several factors have combined to drive manufacturing investment to record levels.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
For my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
Real Time with... IPC APEX EXPO 2024: An Introduction to Mastering IPC Certifications With Blackfox
Darin Pesola, master instructor for IPC certifications and sales manager at Blackfox, discusses the development of training materials for their training centers and online courses. Darin also emphasizes the challenging space addendum training course, which involves meticulous tasks and takes a week to complete. Upon finishing, students can demonstrate their acquired skills and move into the workforce.
Real Time with... IPC APEX EXPO 2024: IPC Government Relations Holds Lawmakers Accountable
The IPC Government Relations team is constantly educating Congress and the executive branch about the importance of a robust domestic electronics manufacturing industry. As Richard Cappetto explains, the GR team is focused on proactive strategies, workforce policies, and sustainability, as well as the significance of apprenticeship programs, President Biden's executive order, and employer incentives. Also discussed is the PCB Act, its investment program, tax incentive, and DoD's understanding of supply chain risk.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
As we publish this week’s most-read news, the I-Connect007 team is wending its way home from an eventful and productive week at IPC APEX EXPO in Anaheim, California. We’ve posted a variety of dispatches from the show this week, released 73 realtimewith.com video interviews (and counting), and also gathered the content and updates you’ll be looking for in the upcoming issue of Show & Tell… IPC APEX EXPO 2024.
The Impact of U.S. Defense Production Act on PCB Industry
This interview with David Schild, executive director of PCBAA, covers the recent passage of the Defense Production Act and its impact on the printed circuit board industry. It highlights the importance of funding, domestic production, and government support for the industry's growth. He mentions proposed legislation like the Protecting Circuit Boards and Substrates Act and the need for a strategic approach to national security and supply chain resilience.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We are well into trade show season and what a season it has been so far! SMTA Dallas, IMAPS, and the SMTA UHDI Symposium have filled out the past two weeks as we barrel toward IPC APEX EXPO in just a week’s time. There have been many exciting announcements of equipment and technology that will be showcased at IPC APEX EXPO, including announcements from Ventec, Blackfox, Insulectro, Indium, and more. Click through the news to see what’s in store for the big show.
SMTA Conducts First UHDI Symposium
SMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.
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