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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
Is Washington Ready to Get Serious About PCBs?
David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In part one of this interview, he reflects on how a “perfect storm” during the COVID-19 pandemic actually ignited the conversation that has allowed PCBAA to flourish: Years of advocacy, the shock of COVID-era supply chain disruptions, and the long road to the CHIPS Act have helped to reshape the federal mindset on industrial policy.
MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics
The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Lately, I’ve been thinking a lot about storytelling. Partly because I’m reading "Creativity, Inc.," by Ed Catmull, and partly because it’s impossible to separate Pixar’s success from the power of the stories it tells, both on screen and behind the scenes. Everything matters to Pixar—from the technology to the leadership—but what makes Pixar truly special is the stories it tells about human emotions. They make our human complexity understandable.
USPAE Grants ‘Greater Access’ to Defense Electronics Manufacturers
Chris Peters, co-founder of the U.S. Partnership for Assured Electronics and expert on manufacturing supply chains, recently announced he would be stepping back from his role. I first met Chris in the spring of 2020, when SMT007 Magazine interviewed him for the July 2020 issue. I was pleased that Chris took the time to reflect on the USPAE, past present and future, and his optimism is infectious.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it. Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
Where Electronics Manufacturing Turns for Trusted Technical Insight
In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
Restoring U.S. Industrial Agility: Nurturing Domestic UAV Supply Chains
Unmanned aerial vehicles (UAV) illustrate the risk of globally dispersed electronics supply chains. But they also offer an opportunity for the U.S. to reimagine World War II’s “freedom’s forge” by building domestic electronics and component manufacturing that is hardwired for agility, speed, scalability and resilience.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Happy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”
I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.
Advance Your Electronics Career in 2026: Upcoming Instructor-Led Courses from Electronics U
Staying competitive in the electronics industry requires continuously strengthening your technical expertise. Electronics U is excited to present a new lineup of expert-led, online courses designed to elevate your skills in PCB design, electronics assembly, wire harness design, program management, and more. Whether you're looking to build foundational knowledge or expand into specialized applications, these immersive, instructor-guided sessions will help you master the tools and techniques that today’s leading companies rely on.
Happy New Year from the I-Connect007 Staff
The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.
Voices of the Industry Podcast Explores the Evolving Role of Inspection Systems in EMS Manufacturing
Inspection technology continues to play a pivotal role in the evolution of electronics manufacturing services, and the latest episode of Voices of the Industry brings that conversation into sharp focus. Hosted by I-Connect007’s Nolan Johnson, this episode features Joel Scutchfield of Koh Young, a recognized leader in 3D measurement-based inspection systems.
Denny Fritz: A Hall-of-Fame Career in PCBs
From DuPont to the Navy’s top electronics programs, Defense Speak Interpreted columnist Dennis “Denny” Fritz has devoted his career to advancing defense technology and collaboration. In this interview, Denny reflects on decades of leadership, service, and innovation, offering timeless advice on staying technically active and leading with purpose.
CMMC 2.0: What You Need to Know
Tenets of the Department of Defense's (DoD) Cybersecurity Maturity Model Certification Program (CMMC) 2.0 went into effect on Nov. 10. What are the primary differences between 1.0 and 2.0 compliance, and what exactly must be in place now? CMMC 2.0 is now being written into DoD contracts and enforced through DFARS (Defense Federal Acquisition Regulation Supplement), with a three-year phased rollout. For PCB and electronics manufacturers in the defense supply chain, this is now a real gate to doing business with the DoD, not a “nice to have.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
What a year it’s been! I don’t think anyone could have anticipated the level of shake-up that was to come on the global trade scene when U.S. President Donald Trump came into his second term in January, but the drama that has ensued rivals anything ever aired on “The Apprentice.” However, I am somewhat heartened by our current position compared to how things felt in Q2 of this year. Much remains to be worked out, but as we sprint into the new year, there are three things I know for sure: 1) Working in tech is never dull—you will not be bored in 2026; 2) Expect to work very hard; and 3) Business, like life, will go on no matter what. I hope you enjoy my picks for week: all good reads for different reasons. Happy New Year!
Merry Christmas from I-Connect007!
The I-Connect007 offices are closed today, in observance of the Christmas holiday. As part of the Global Electronics Association, the offices remain closed through New Year’s Day. I-Connect007 will still publish daily and weekly newsletters (with the exception of Christmas and New Year’s Day). Some staff members will still be checking email. Just for fun, we thought we’d share a bit of Christmas tradition about the gingerbread house. You’ve likely built one at some point and perhaps wondered how this tradition originated.
SMTA Space Coast: What's Needed to Modernize Defense Solder Standards
Long-time lead-free solder investigator, Denny Fritz, hit the SMTA Space Coast Expo in November to drum up support for an initiative to include lead-free solder in milaero-based printed circuit board assemblies. In this interview, Denny provides background on the genesis of the “consider all solders” project and why it matters to continue leading this effort.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Before diving into this week’s must-reads, I want to spotlight the incredible batch of interviews our team captured at productronica. They go beyond the quick booth chitchat and dig into the most pressing topics in electronics manufacturing. We spoke with companies and leaders who are shaping what happens next, and the conversations touch on the challenges and innovations that matter most to the industry today.
The Next Five Years of Thermal Substrates, Ceramics, and Thick-film PCBs
If you want a clean view of where thermal substrates and ceramic/thick-film electronics are headed, follow the heat. Power density is moving up and to the right across industries: EV traction inverters, fast chargers, AI data centers, radar, satellite payloads, medical imaging, and high-brightness LEDs. The next five years will be defined by designs that treat thermal performance as a first-order constraint, not an afterthought. Here’s what that means in practice.
I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest
Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.
Jesse Vaughan: A Basketball and PCB Industry ‘Fanatic’
A third-generation PCB technologist and lifelong basketball enthusiast, Jesse Vaughan shares how family legacy, grit, and a love of innovation shaped his path from the court to the cleanroom. In this interview, the Beyond the Board columnist reflects on risk-taking, resilience, and the boundless future he envisions for the U.S. PCB industry
I-Connect007 Closes for Thanksgiving Day
I-Connect007 recognizes Thanksgiving Day and its office will be closed Nov. 27–28, 2025. The Thanksgiving holidays, as celebrated across North America, trace their roots to early harvest celebrations, expressions of gratitude, and moments of national significance. In Canada, Thanksgiving is often linked to explorer Martin Frobisher’s 1578 Arctic expedition, where he held a ceremony giving thanks for a safe passage—decades before the Pilgrims arrived in North America.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Were you one of the lucky ones who made it to Europe’s largest electronics trade show this week? By all accounts, this massive event was buzzing with new technologies, packed booths, and plenty of tired feet by the end of each day. So, if you’re heading home from productronica (or, like me, just enjoying the end of a busy week), now’s the perfect time to unwind a bit. Settle into that airplane seat (or office chair), grab a snack, and catch up on some great reads from I-Connect007.
The Purity of Certification
The global context has changed dramatically. The United States has imposed tariffs on China and other countries with the goal of protecting its market and reducing dependence on distant supply chains. This measure has triggered a strategic realignment in manufacturing: Many companies are now seeking to establish operations closer to their main customer.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Real Time with... SMTA International 2025: Navigating Cybersecurity and Compliance in Manufacturing with Integris
Marcy LaRont introduces Michael Doucette from Integris at the SMTAI show, where they discuss the significance of networking and the new CMMC level 2.0 compliance requirements for manufacturers with DOD contracts. Integris shares their approach to technology assessments and highlights common cybersecurity risks. They emphasize the shift to cloud services and provide practical cybersecurity tips, underscoring the increasing importance of cybersecurity in IT strategies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
A New Era for Global Trade and Electronics
The global trade system is undergoing an enormous, systemic paradigm shift. For decades, the World Trade Organization (WTO), with the support of the United States, its traditional European allies, and many other nations, stood at the center of efforts to create fairer, more predictable, and rules-based commerce. Today, however, that model is giving way to a more fragmented reality—so far U.S.-driven—in which individual nations and blocs are striking deals and imposing a variety of rules of their own liking.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.
Waging the Battle for American PCB Reshoring
Legislation is shaping global trade, tariffs, and sustainability and environmental regulations. David Schild of PCBAA discusses exactly where the U.S. stands in its efforts to reshore printed circuit board manufacturing for critical industries. This conversation at PCB West occurred on the first day of the federal government’s shutdown, so it seemed especially timely to hear David's thoughts and insights on how the current political climate is affecting efforts to achieve the U.S. industry’s reshoring goals.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Light-curable Solutions for Reliable Electronics in Space Applications
Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
SEMICON West: The Path to a $1 Trillion Future
After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics
According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week. We’ve been covering PCB West, and we’ll be bringing you a variety of news and interviews from the show in the next few weeks. We’ll also be attending SMTA International later this month, and productronica as trade show season rolls on.
This week, we have a number of interesting columns and news items. We start with a positive story about North American PCB sales, which were heading in the right direction in August. Don Ball writes about the ins and out of working with overseas partners, and there’s a great column by Dan Beaulieu on avoiding the temptation to offer discounts when your customer gets squirrely.
Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.
IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.
Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials
Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.
Cyient DLM, A Voice from the Frontlines
Once seen as a low-cost, build-to-print destination, India’s EMS sector is rapidly emerging as a global hub for high-reliability electronics, particularly in strategic sectors like aerospace, defense, and medical. As such, we highlight some companies that exemplify the strength and potential of Indian manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.
UHDI Fundamentals: UHDI Technology and Quality 5.0
The convergence of ultra-high density interconnect (UHDI) technology and Quality 5.0 represents a transformative leap in electronics design and manufacturing. UHDI enables extreme miniaturization and enhanced performance, while Quality 5.0 delivers adaptive, intelligent human-centric quality systems. Together, they set the foundation for advanced electronics that are smarter, more resilient, and more sustainable.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
With a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Weaning the U.S. Military Off a Tablet Supply Chain That Leads to China
Tablet computers are essential to how our military fights, moves and sustains, but these devices are built on a fragile global supply chain with strong ties to China. Building domestic manufacturing to eliminate this vulnerability is feasible if we tap into the information and capabilities that already exist and create strong demand for tablets produced by trusted and assured sources.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
Labor Day: U.S. Federal Holiday
Today is Labor Day, a U.S. federal holiday that Americans celebrate on the first Monday of September each year. This marks the 131st anniversary of the holiday. In 1887, Oregon was the first state to make Labor Day an official holiday. In 1894, after the Pullman Strike, Congress passed a bill that recognized Labor Day as a federal holiday, and President Grover Cleveland signed the bill into law.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Coming Soon: The Advanced Electronics Packaging Digest
The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
TTM Technologies: Bridging East and West with Strategic Expansion
As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."
50% Copper Tariffs, 100% Chip Uncertainty, and a Truce
If you’re like me, tariffs were not on your radar screen until a few months ago, but now political rhetoric has turned to presidential action. Tariffs are front-page news with major developments coming directly from the Oval Office. These are not typical times. President Donald Trump campaigned on tariff reform, and he’s now busy revamping America’s tariff policy.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In our industry, my top reads include Prashant Patel’s overview and argument for reshoring, which I found to be a great general overview and breakdown. In further support of the onshoring/reshoring message, I’m highlighting Nolan Johnson’s interview on the survey and report by the Reshoring Initiative. Check out my interview with USPAE’s Jim Will on the state of the flat panel display (FPD) industry and the risks associated with it for U.S. defense and critical infrastructure products.
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