Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Great Wall Motors Debuts Mocca DHT-PHEV LIDAR Edition Vehicle
August 26, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
The new Mocca DHT-PHEV LIDAR Edition—under the WEY brand of Great Wall Motor, GWM—made its debut at the Chengdu Motor Show. Building on the relationship between Great Wall Motor and Qualcomm Technologies, Inc., the Mocca DHT-PHEV LIDAR Edition will be equipped with Snapdragon Digital Chassis solutions, leveraging Snapdragon Auto Connectivity Platforms for fast and reliable connectivity and the 3rd Generation Snapdragon Cockpit Platform for its leading compute performance, and rich audio and visual processing capabilities. The Mocca DHT-PHEV LIDAR Edition also utilizes the Snapdragon Ride™ Platform for advanced driving assistance systems (ADAS), and automated driving systems (AD), becoming China’s first commercialized vehicle to feature the Snapdragon Ride Platform, which WEY leveraged to develop their ICU 3.0 – a high-performance production-ready compute platform for AD.
The Snapdragon Ride Platform is a comprehensive portfolio for high performance central compute and vision system solutions based on the Snapdragon family of automotive system-on-chips (SoCs) and accelerator products. The Snapdragon Ride Platforms are scalable, low-power high performance platforms that allow for scaling all tiers of the ADAS and AD systems, ranging from regulatory NCAP solutions to highly automated driving. With the Snapdragon Ride Platform, the WEY Mocca DHT-PHEV LIDAR Edition is designed to process more than 12 cameras, multi-radars and lidars on the combination of the industry leading 5nm ADAS SoC and accelerator, while implementing a safety critical ADAS system. The Snapdragon Ride Platform provides differentiated intelligent driving solutions and unique customization for the WEY Mocca DHT-PHEV LIDAR Edition, from concept to start of production in less than 2 years.
Additionally, and building on the comprehensive portfolio of the Snapdragon Digital Chassis, the WEY Mocca DHT-PHEV LIDAR Edition aims to deliver safe, premium “dual-intelligent experiences” by combining sophisticated human-machine interactions (HMI) in intelligent cockpit and rich features in intelligent driving for drivers and passengers, such as support for real-time rendering, high-resolution display and extreme color reproduction of images captured with vehicle’s cameras on its cockpit screens, which allows users to enjoy more convenient, smarter and safer immersive driving experiences.
Great Wall Motors and Qualcomm Technologies have collaborated closely for several years across multiple technology areas, including advanced in-vehicle connectivity and digital cockpit. Leveraging both companies’ expertise in innovation, Great Wall Motors, usingQualcomm Technologies’ products, has launched several commercial vehicles, driving the transformation of automotive industry in the digital era. The WEY Mocca DHT-PHEV LIDAR Edition is the latest achievement that Great Wall Motors and Qualcomm Technologies are continuously expanding collaborations to enhance intelligent connected vehicle (ICV) experiences with the Snapdragon Digital Chassis solutions.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.