Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
RF Antenna Design and Layout Tips for Your PCB
April 26, 2023 | Cody Stetzel, Cadence Design SystemsEstimated reading time: 1 minute
RF antenna design and layout is one area that requires careful attention to detail and some pointers from mixed-signal designers. If you’re just getting started with high-frequency analog design, follow these tips to ensure isolation and signal integrity in your RF design.
These days, it’s hard to think of a consumer product that doesn’t contain an antenna. Even my garage door opener can connect to my phone via Bluetooth or Wi-Fi. Each time a new RF antenna gets added to a PCB layout, it can create a new headache for RF designers, especially as analog design skills start to become critical again. With so many RF capabilities being added to new PCBs, how can designers ensure the signals in their system are not corrupted and signal integrity is preserved?
Thankfully, there are some simple design choices you can make to help ensure your RF signals are not degraded by nearby digital components. These same design choices will help prevent multiple analog signals from interfering with each other. While there are plenty of topics in RF design to consider when designing mixed-signal or all-RF systems, antenna design and layout are probably two of the most important. Here’s what you need to know about RF antenna design in your PCB and how to ensure analog signal integrity.
To read this entire article, which appeared in the April 2023 issue of Design007 Magazine, click here.
Share on:
Suggested Items
HyRel Technologies Celebrates Future Innovators: Intern Program Empowers the Next Generation of Engineers and Professionals
05/01/2025 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Siemens Expands Global Electronics Intelligence Reach and Supplyframe Portfolio with Wevolver Acquisition
04/30/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced its intention to acquire Wevolver, expanding its audience reach, enhancing the Supplyframe product portfolio, and combining digital marketing and integrated campaign programs that include go-to-market support and content creation.