Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
RF Antenna Design and Layout Tips for Your PCB
April 26, 2023 | Cody Stetzel, Cadence Design SystemsEstimated reading time: 1 minute
RF antenna design and layout is one area that requires careful attention to detail and some pointers from mixed-signal designers. If you’re just getting started with high-frequency analog design, follow these tips to ensure isolation and signal integrity in your RF design.
These days, it’s hard to think of a consumer product that doesn’t contain an antenna. Even my garage door opener can connect to my phone via Bluetooth or Wi-Fi. Each time a new RF antenna gets added to a PCB layout, it can create a new headache for RF designers, especially as analog design skills start to become critical again. With so many RF capabilities being added to new PCBs, how can designers ensure the signals in their system are not corrupted and signal integrity is preserved?
Thankfully, there are some simple design choices you can make to help ensure your RF signals are not degraded by nearby digital components. These same design choices will help prevent multiple analog signals from interfering with each other. While there are plenty of topics in RF design to consider when designing mixed-signal or all-RF systems, antenna design and layout are probably two of the most important. Here’s what you need to know about RF antenna design in your PCB and how to ensure analog signal integrity.
To read this entire article, which appeared in the April 2023 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams
05/21/2025 | SiemensSiemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
05/21/2025 | ZukenZuken, a global leader in electronic design automation (EDA) solutions, has announced the release of the 2025 updates to its flagship PCB design applications, CR-8000 Design Gateway and Design Force.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.