Alps Alpine Selects Siemens’ Symphony Platform to Verify its Newest Mixed-signal Capacitance Detection IC
April 26, 2023 | SiemensEstimated reading time: 1 minute

Siemens Digital Industries Software has announced that Alps Alpine, a leading manufacturer of electronic components and in-vehicle information devices, used Siemens’ Symphony platform for mixed-signal applications when developing and verifying its newest, functionally safe capacitance detection integrated circuit (IC). Alps Alpine’s new offering enables proximity, touch, and spatial gesture detection across a wide range of human-machine interface systems in demanding applications such as the automotive and smart device spaces.
Using Siemens’ Symphony platform, Alps Alpine quickly achieved silicon accurate simulation for its touch detection IC, increasing functional verification productivity by 5x. This reduction of verification cycles facilitated rapid attainment of time-to-market goals for the customer.
"A major feature of our latest IC is the use of absolute self-capacitance detection to achieve outstanding high sensitivity and noise resistance performance," said Akihisa Iikura, IC design manager for Alps Alpine. "As a manufacturer of in-vehicle electrical components, we are required to comply with the ISO26262 functional safety standard, and the semiconductors we use must additionally comply with aggressive Automotive Safety Integrity Level-B (ASIL-B) requirements. Siemens’ Symphony platform helped us to rapidly and successfully design and verify our design’s complex operations and functionality. The Symphony platform’s exceptional performance, together with its user-friendly interface, led to greater adoption among our verification teams, ultimately resulting in a 5x increase in productivity.“
Alps Alpine has a track record of more than 20 years in semiconductor design, and the company has mass-produced billions of units over that timeframe.
Powered by Siemens' Analog FastSPICE platform, the Symphony platform provides a seamless combination of foundry-certified circuit simulators and industry-standard HDL simulators for efficient and precise verification of complex nanometer-scale mixed-signal ICs. Its modular design leverages Siemens’ Analog FastSPICE platform for exceptional speed and accuracy in mixed-signal simulation and its compatibility with leading digital solvers, such as the functional verification engine of Siemens’ Questa™ platform, extends debug productivity.
"The need for high-sensitivity capacitive sensing technology is becoming critical in many human-machine interface applications, and mixed-signal innovations such as Alps Alpine’s capacitance detection solutions are critical to meet those requirements," said Amit Gupta, vice president and general manager for the Custom IC Verification Division at Siemens Digital Industries Software. “We are pleased that our Analog FastSPICE and Symphony platforms played a key role in Alps Alpine’s development of its latest mixed-signal, functional safety standard compliant capacitance detection IC design.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.