Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
NextFlex Calls for 3D Imaging Technology Proposals
May 10, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
Nolan Johnson talks with Scott Miller about a special "Open Project" call for proposals which NextFlex currently is exploring for methods to dewarp 3D scans of physical boards to enable multi-image scans to be stitched together. There is the possibility of funding for viable proposals. Deadline is May 15, 2023.
About NextFlex Project Calls
Along with developing the workforce of the future and promoting a sustainable advanced manufacturing ecosystem, NextFlex is also focused on accelerating flexible electronics technology innovation and commercialization through pre-competitive partnerships.
Via a series of Project Calls that provide cash awards to proposal teams for development projects that are critical to Flexible Hybrid Electronics (FHE) manufacturing, NextFlex underwrites up to 50% of the development costs of selected projects. The Project Call process follows a structured selection process and rigorous oversight methodology to ensure diversity and breadth in the selection of projects funded.
About Open Project Calls
Opportunities exist to move the Flexible Hybrid Electronics (FHE) industry forward that are either outside the scope of traditional Project Call topics or are revolutionary ideas of which the NextFlex Technical Working Groups and community may not be aware. The Open Project Call has been established to respond to these advanced manufacturing and flexible electronics opportunities through an RFI (Request for Ideas), to which proposers may submit a white paper. Learn more.
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