Toyochem Constructs New Pilot Facility for High-performance Polymers in Japan
June 5, 2023 | ToyochemEstimated reading time: 1 minute
Toyochem Co., Ltd., the polymer and coatings arm of Japan’s Toyo Ink Group, announced today that it has completed construction of a new Polymer Pilot Facility at its Kawagoe Factory, a manufacturing complex located in Kawagoe City, Saitama Prefecture in Japan. The new Facility, which came online in April 2023, is engaged in the prototyping and medium-scale production of advanced polymers and their composites. In the first-phase production line, Toyochem plans to manufacture condensation polymers that exhibit high heat resistance and high flexibility, properties needed to fulfill the very demanding requirements of today’s semiconductor components. Key applications include high heat resistant and flexible adhesive materials for high-speed communication components and functional adhesives for electric vehicles.
In line with its growth strategy, Toyochem, with the cooperation of its Polymer Materials Research Institute in Japan and the new Polymer Pilot Facility, is expected to accelerate development of new products and related businesses needed to support its customer base now and well into the future. “The Toyo Ink Group has a long track record of manufacturing polymers based on acrylics, urethanes, polyesters and their composites for use primarily in can coatings, adhesives, laminating adhesives and inks,” said Yasushi Ariyoshi, Division Director of the Polymer & Coating R&D Division at Toyochem.
“Over the years, the Group has reinforced our capability and technological base to engineer our own polymer-based systems. Recently, Toyochem has been focusing its efforts on developing a series of high-functional products, including environmentally friendly types and performance coatings for the electronics field. These applications require improved properties to satisfy the most demanding requirements. And the establishment of a new pilot facility bolsters our ability to develop and deliver new polymer grades needed to meet the future performance and sustainability demands of our customers.”
In addition to serving as a model system for the trial production of new polymers, Toyochem’s Polymer Pilot Facility is also being used to consolidate polymer pilot areas at Kawagoe and to accumulate data needed to enhance smart-factory initiatives incorporated at its manufacturing sites.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.