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APCT Now Offering Full Turnkey Solutions
August 16, 2023 | APCTEstimated reading time: Less than a minute
With the recent acquisition of Advanced Circuits and the subsequent acquisition of San Diego PCB Design, APCT has become the second largest printed circuit manufacturer in North America offering design, fabrication and assembly.
The design team is experienced and has the ability to offer its expertise in a number of design layout services: standard through-hole, high-density interconnect (HDI), signal/power integrity design, dense high-speed digital, and RF and rigid-flex. The IPC certified designers deliver accurate, high-reliability PCB layout designs to hundreds of customers across North America.
The assembly operation is located within the ACI headquarters in Aurora, Colorado. At this time, assembly is viewed as a “value add” to their customer base only. Offerings include both through-hole and surface mount capabilities, supporting prototype quantities of standard technology. All assembly is completed In-House.
Also available to the customer base is kitted/consigned, partial turnkey and full turnkey.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.