-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC’s PCB Technology Trends Report Details How PCB Manufacturers Meet Current and Future Technology Demands
October 11, 2023 | IPCEstimated reading time: 1 minute
PCB Technology Trends 2023, IPC’s biennial global study, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2028 that will affect the whole industry. Based on data from 60 companies worldwide, the 48-page report presents data on PCB technology and OEMs’ PCB requirements as of 2023, as well as OEMs’ use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.
This report covers five main focus areas: higher density, design concerns/signal integrity, change in processing/manufacturing techniques, technical business challenges, and compliance/environmental issues.
Data from report indicate:
- HDI (high density interconnect) usage/fabrication has increased from 37.5% to just over 49% in five years. In addition, the median has shifted from 35% present day to 50% in five years. This indicates more of the respondents predict even greater usage/specification of HDI boards in five years.
- In terms of PCB design limitations, heat dissipation is a major concern based on the respondents’ answers. The majority of the respondents (71%) indicated thermal vias are the primary method to manage heat dissipation.
- Respondents indicated that there will be continued use of a variety of solderable finishes. The consensus that there is no universal finish (one that meets everyone’s needs) is prevalent.
- Respondents face a wide variety of business challenges: achieving better yields, moving up the technology curve, workforce training and finding competent personnel are key levers needed to drive business.
- Respondents overwhelmingly are losing sleep over workforce development, lack of staff’s basic engineering skills, supply chain lead times and product overregulation.
PCB Technology Trends 2023 is available to IPC members for $595 and $995 for nonmembers.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar InstrumentsTransmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.
Axxon-Mycronic Brings High-Performance Conformal Coating to productronica India 2025
08/20/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is pleased to announce its participation in productronica India 2025, taking place September 17–19 at the Bangalore International Exhibition Centre (BIEC).
The Marketing Minute: Staying Positive When the Market Isn’t
08/20/2025 | Brittany Martin -- Column: The Marketing MinuteIn today’s volatile electronics market, buffeted by tariffs, supply-chain shifts, and squeezed margins, it’s tempting to tighten belts and cut your marketing budget. But history shows us that the quietest brands get forgotten fastest. Staying visible is not a luxury; it’s a competitive advantage.
Eltek Ltd. Reports Strong Second-Quarter 2025 Results
08/14/2025 | PR NewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the quarter ended June 30, 2025.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.