Intel Demonstrates Breakthroughs in Next-Generation Transistor Scaling for Future Nodes
December 11, 2023 | IntelEstimated reading time: 2 minutes
Intel unveiled technical breakthroughs that maintain a rich pipeline of innovations for the company’s future process roadmap, underscoring the continuation and evolution of Moore’s Law. At the 2023 IEEE International Electron Devices Meeting (IEDM), Intel researchers showcased advancements in 3D stacked CMOS (complementary metal oxide semiconductor) transistors combined with backside power and direct backside contacts. The company also reported on scaling paths for recent R&D breakthroughs for backside power delivery, such as backside contacts, and it was the first to demonstrate successful large-scale 3D monolithic integration of silicon transistors with gallium nitride (GaN) transistors on the same 300 millimeter (mm) wafer, rather than on package.
“As we enter the Angstrom Era and look beyond five nodes in four years, continued innovation is more critical than ever. At IEDM 2023, Intel showcases its progress with research advancements that fuel Moore’s Law, underscoring our ability to bring leading-edge technologies that enable further scaling and efficient power delivery for the next generation of mobile computing,” said Sanjay Natarajan, Intel senior vice president and general manager of Components Research.
Transistor scaling and backside power are key to helping meet the exponentially increasing demand for more powerful computing. Year after year, Intel meets this computing demand, demonstrating that its innovations will continue to fuel the semiconductor industry and remain the cornerstone of Moore’s Law. Intel’s Components Research group consistently pushes the boundaries of engineering by stacking transistors, taking backside power to the next level to enable more transistor scaling and improved performance, as well as demonstrating that transistors made of different materials can be integrated on the same wafer.
Recent process technology roadmap announcements highlighting the company’s innovation in continued scaling – including PowerVia backside power, glass substrates for advanced packaging and Foveros Direct – originated in Components Research and are expected to be in production this decade.
At IEDM 2023, Components Research showed its commitment to innovating new ways of putting more transistors on silicon while achieving higher performance. Researchers have identified key R&D areas necessary to continue scaling by efficiently stacking transistors. Combined with backside power and backside contacts, these will be major steps forward in transistor architecture technology. Along with improving backside power delivery and employing novel 2D channel materials, Intel is working to extend Moore’s Law to a trillion transistors on a package by 2030.
Intel delivers industry-first, breakthrough 3D stacked CMOS transistors combined with backside power and backside contact:
Intel’s latest transistor research presented at IEDM 2023 shows an industry first: the ability to vertically stack complementary field effect transistors (CFET) at a scaled gate pitch down to 60 nanometers (nm). This allows area efficiency and performance benefits by stacking transistors. It is also combined with backside power and direct backside contacts. It underscores Intel’s leadership in gate-all-around transistors and showcases the company’s ability to innovate beyond RibbonFET, putting it ahead of the competition.
Suggested Items
America Projected to Triple Semiconductor Manufacturing Capacity by 2032, the Largest Rate of Growth in the World
05/08/2024 | SIAThe Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), released a report on the global chip supply chain that projects the United States will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032.
Real Time with… IPC APEX EXPO 2024: The Driving World of e-Mobility with Indium
05/08/2024 | Real Time with...IPC APEX EXPOIn the competitive EV market, technology plays a crucial role facing the challenges of infrastructure. As Brian O'Leary explains, Indium's e-Mobility product suite includes proven solder and thermal management products for high reliability.
Incap Releases Unaudited Business Review for January–March 2024
05/08/2024 | IncapRevenue for the first quarter 2024 amounted to EUR 51.4 million (1–3/2023: EUR 72.2 million). Year-on-year the revenue decreased 29.3%, as expected.
Schweizer Electronic: Business Development in Q1 2024
05/08/2024 | Schweizer Electronic AGThe sales of the SCHWEIZER Group amounted to EUR 39.2 million in the first quarter of 2024 (Q1 2023: EUR 37.1 million). This corresponds to an increase of +5.5 percent compared to the same quarter of the previous year.
Key Tronic Announces Results for Q3 of Fiscal Year 2024
05/08/2024 | Globe NewswireFor the third quarter of fiscal year 2024, Key Tronic reported total revenue of $140.5 million, compared to $164.6 million in the same period of fiscal year 2023.