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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC Secures Funding for National Apprenticeship Program
July 15, 2024 | IPCEstimated reading time: Less than a minute
IPC announces that it has received funding from Jobs for the Future (JFF) to support registration for its esteemed national apprenticeship program.
This funding opportunity, available until August 31, 2024, offers aspiring professionals the chance to enhance their careers through comprehensive technical training. The funds can be applied to cover all or part of the Related Technical Instruction (RTI) for several high-demand occupations, including:
- Electronics Assembler (51-2011.00)
- PCB Fabricator (17-3023.00)
- Wire Harness Fabricator (51-2092.00)
- PCB Design Engineer (17-3012.00)
Victoria Hawkins, director of workforce grants and proposals at IPC, expressed enthusiasm about the funding. “We are thrilled to provide this opportunity to individuals seeking to advance their skills in the electronics industry. This funding will make a significant impact on their professional growth,” Hawkins stated.
Interested candidates are encouraged to act swiftly to take advantage of this limited-time funding. For more information and to apply, please contact Victoria Hawkins at VictoriaHawkins@ipc.org.
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06/12/2025 | SEMIThe MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.
German Government Issues Final Funding Approval For New Infineon Fab In Dresden
05/08/2025 | InfineonInfineon Technologies AG has received final approval for the funding of its new plant in Dresden (Smart Power Fab) from the German Federal Ministry for Economic Affairs.
Apptronik Raises $350M to Scale Production of AI-Powered Humanoid Robots and Meet Significant Customer Demand
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U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera
01/21/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
01/16/2025 | U.S. Department of CommerceThe U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.