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StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336

06/12/2025 | StratEdge
StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336.

SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements

06/12/2025 | SEMI
The MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.

RTX's Collins Aerospace Expands Aircraft Electrification Capabilities in Europe

06/12/2025 | RTX
Collins Aerospace, an RTX business, expanded its aircraft electrification capabilities with the introduction of a new engineering center of excellence in Wolverhampton, UK, and a new electric thrust reverser actuation systems (elecTRAS) production line in Colomiers, France.

BAE Systems, Hanwha Systems Sign MOU to Develop an Advanced Multi-Sensor Satellite System

06/12/2025 | BAE Systems
BAE Systems and Hanwha Systems have signed a Memorandum of Understanding (MOU) to develop technology and collaborative working to deliver a multi-sensor satellite system for international markets.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
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