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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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iNEMI Connector Footprint Tolerance End-of-Project Webinar
October 24, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.
Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.
Registration
This webinar is open to industry; advance registration is required, click here.
Monday, October 28, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
4:00-5:00 p.m. CET (Europe)
Suggested Items
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Target Condition: Are Autorouters Friend or Foe?
07/01/2025 | Kelly Dack -- Column: Target ConditionFor PCB designers, just hearing the word “autorouters” can trigger everything from eye rolls to heated debate. We all have stories—some painful, some comical—of boards gone sideways at the hands of an overzealous routing algorithm. But these tools aren’t going away, and frankly, they shouldn’t. Used wisely, they can save some project teams hours or even days. Used blindly, they can cost weeks. So, where do autorouting tools stand today, and is interactive routing the smarter path forward?
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.