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Suggested Items

Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage

08/14/2025 | Markus Voeltz -- Column: Global PCB Connections
Designers don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.

Survey Says Reshoring is a TCO Equation

08/13/2025 | Nolan Johnson, SMT007 Magazine
Harry Moser, founder of the Reshoring Initiative, and Kathy Nunnally of Regions Recruiting partnered to survey contract manufacturers and OEMs earlier this year, querying them about their offshoring beliefs and practices. They found that while offshoring, tariffs, trade balances, and the like, are important to a company’s bottom line, there’s a larger and more extensive issue: workforce. In this interview, they detail the results of that survey and what they believe can and should be done to fix this long-standing issue.

SIA Statement on Semiconductor Tariffs Announcement

08/08/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding President Trump’s semiconductor tariff announcement.

A Plan for Floor Planning: Design007 Magazine August 2025

08/08/2025 | I-Connect007 Editorial Team
Floor planning is full of potential pitfalls—but don’t worry. This month’s contributors share best practices and actionable strategies to help you avoid that dreaded 5:30 p.m. Friday call from the fabricator. Engineers have to weigh dozens (sometimes hundreds) of tradeoffs to balance electrical performance with physical and cost constraints. The decisions made here ripple through the rest of the project: stackup choices can come back to haunt you, and component placement can impact signal integrity, routing efficiency, and overall manufacturability. And as pitch shrinks, the margin for error disappears.

UHDI Fundamentals: UHDI Technology and Industry 4.0

08/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
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